Search results for "chiplet"

United Microelectronics Corporation (UMC) and Cadence have announced that the Cadence 3D-IC reference flow has been certified for UMC’s chip stacking technologies, enabling faster time to market.

According to IDTechEx, on 7th of October 2022, the US announced a series of targeted updates to its export regulations concerning semiconductors and associated technologies in China.

Siemens Digital Industries Software has announced that Chipletz has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate products.

SEMICON Japan opened at Tokyo Big Sight with more than 670 exhibitors from 11 regions showcasing their latest products and technologies.

If the future were to be categorised in one word, it would be "data-centric". For decades, IC vendors have designed chips that have all functions integrated on the same die; however, scaling monolithic IC becomes more difficult and costly as the industry sees the slowdown of Moore's law.

The growth of AI is having a strong impact on server processor technology. First, extensions enabling accelerated AI inferences are being added to CPUs.

This article fromPaddy Williams, Director of Product Marketing for CEVA’s Connectivity Business Unit looks at the wearables market and considers how innovation, such as RedCap (reduced capacity), can improve smart watches.

Renesas has introduced its clock buffers and multiplexers that meet stringent PCIe Gen6 specifications.

IT/OT convergence at the edge needs customised server solutions with scalable performance to match individual requirements. Developing such solutions requires embedded support for key hardware components.

Lanner’s NCA-6110 is a 2U high-performance rackmount network appliance designed for network security, application delivery and WAN optimisation.