Memory

Synchronous SRAMs claimed to be the industry’s highest-density have been released by Cypress Semiconductor. The integrated ECC feature enables the new 36Mb synchronous SRAMs to provide the highest levels of data reliability, simplifying designs for a wide variety of military, communication and data processing applications.

A family of 4Mb serial Ferroelectric Random Access Memories (F-RAMs), claimed to be the industry’s highest density, have been introduced by Cypress Semiconductor. The 4Mb serial F-RAMs feature a 40Mhz SPI, a 2.0-3.6V operating voltage range and are available in industry-standard, RoHS-compliant package options. All F-RAMs provide 100tn read/write cycle endurance with 10-year data retention at 85°C and 151 years at 65°C. 

Micron Technology announced a recent addition to its expansive portfolio of flash storage products, providing a purpose-built solution for cost-sensitive consumer applications seeking high performance and reliability. The TLC (Triple-Level Cell) NAND is built on its 16nm process and delivers a balanced set of features for applications like USB drives and consumer solid state drives.

Demand for NAND-based digital memory is booming, driven by increased use of devices that span the consumer and mobile markets, automotive and industrial sectors and the emerging Internet of Things (IoT). By Eugen Pfumfel, Principal Engineer, Memory Marketing, Toshiba Electronics Europe

An embedded SRAM IP that targets applications demanding long battery life with minimal operating and stand-by power performance has been released by sureCore. Supporting a wide operating voltage range of 0.7-1.2V, the single port SRAM boasts dynamic power savings exceeding 50% of current commercial offerings. The IP also cuts static power by up to 35% with a 10% area penalty.

  Alliance Memory has announced that its 512M SDRAM devices, which it recently acquired from Micron Semiconductor, will be available with their original Micron part numbers into 2017. 

Expanding the MachXO3 FPGA family, Lattice Semiconductor has announced that the MachXO3LF are provided with on-chip Flash for configuration and usage. They utilise the same advanced package technology as the MachXO3L family to provide a small-footprint, the highest I/O density on the market and easy migration without changing PCB design.

TDK has announced the August 2015 availability of its SDS1B series of 6Gb/s Serial ATA compatible 2.5" SSDs for industrial applications, featuring the GBDriver GS1 NAND flash memory controller chip. The SSDs are designed for use in factory automation, railway equipment, kiosk, POS, ATM, banking & till terminals, in-car navigation systems, office equipment, digital signage, medical measuring & diagnostic equipment, 4G LTE-A base ...

sureCore has announced the opening of its latest design centre in Leuven, Belgium. The company chose the Leuven location to tap into the design ecosystem around imec and to maximise imec's recently announced investment in the company.

A line of high-speed CMOS DDR SDRAMs, which provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, medical, communications and telecomms products, has been introduced by Alliance Memory. The line of devices consists of the AS4C32M8D1, a 256Mb DDR SDRAM, the AS4C64M8D1 a 512Mb DDR SDRAM and the AS4C64M16D1, a 1Gb DDR SDRAM. The devices are available in a 60-ball 8x13x1.2mm TFBGA package or a ...