Memory
Single-system testing for SAS, SATA & PCIe protocol SSDs
Advantest has announced firmware that enables all MPT3000 systems to test Serial Attached SCSI (SAS) 12G and Serial ATA (SATA) 6G SSDs, making this tester the first true single-system solution for testing SAS, SATA and PCIe protocol SSDs. The addition of SAS and SATA to the proven support for PCIe 3.0, NVMe and AHCI extends the platform’s test coverage to include SSDs that use any of today’s major protocol standards.
Revolutionary memory technology
Intel and Micron Technology have unveiled 3D XPoint technology, a non-volatile memory that has the potential to revolutionise any device, application or service that benefits from fast access to large sets of data. Now in production, 3D XPoint technology is a major breakthrough in memory process technology and the first new memory category since the introduction of NAND flash in 1989.
Embedded peripheral modules supply additional storage
A full and comprehensive range of Embedded Peripheral Modules from Innodisk is available at Review Display Systems (RDS). These Embedded Peripheral Modules add flexibility to embedded design with increased configuration and end use options. Innodisk provides industrial embedded flash and DRAM storage products and technologies in space saving form factors.
Efficiently store gigabytes of data on MCU NAND flash
Segger has upgraded the emFile file management system for embedded applications by adding a block grouping feature to reduce the amount of RAM needed for block management of NAND flash memory. NAND can now be used for gigabytes of data with smaller MCUs.
Advanced low-power SRAM improves reliability & backup battery life
Renesas has launched two series of Advanced Low Power SRAM, the leading low-power SRAM designed for enhanced reliability and longer backup battery life for factory automation, industrial equipment and smart grid applications. Fabricated using the 110nm process, the RMLV1616A series of 16Mb devices and the RMWV3216A series of 32Mb devices feature an innovative memory cell technology that dramatically improves reliability and contributes to longer ...
Organic molecules used to stabilise magnetic orientation
Organic molecules allow producing printable electronics and solar cells with extraordinary properties. In spintronics, too, molecules open up the unexpected possibility of controlling the magnetism of materials and, thus, the spin of the flowing electrons. According to what is reported in Nature Materials by a German-French team of researchers, a thin layer of organic molecules can stabilise the magnetic orientation of a cobalt surface.
PMIC selected for SSD use
STMicroelectronics has announced its 5-channel PMIC (L7292) has been selected by Kingston Technology Company for its enthusiast-class HyperX Savage SSD. Compared with designs using low drop-out regulators (LDO) or other multi-channel PMICs, ST’s L7292 offers the highest level of integration, flexibility and programmability, and enables higher efficiency with compact and simplified PCB design.
CMOS DDR3L SDRAM offers a 8Gb density in a 96-ball package
A monolithic high-speed, low-voltage CMOS DDR3L SDRAM with an 8Gb density in a 96-ball, 9x14mm, lead (Pb)-free FBGA package has been released by Alliance Memory. Featuring silicon provided by Micron Technology, the AS4C512M16D3L (512M x 16) offers a double data rate architecture for extremely fast transfer rates of up to 1600Mbps/pin and clock rates of 800MHz.
Imec and Panasonic demonstrate breakthrough RRAM cell
Imec and Panasonic have announced that they have fabricated a 40nm TaOx-based RRAM technology with precise filament positioning and high thermal stability. This breakthrough result paves the way to realising 28nm embedded applications. The results were presented at this year’s VLSI technology symposium.
1Mb SPI FRAM device offered in a WL-CSP
Fujitsu Semiconductor Europe has launched an ultra small package for the 1Mb SPI FRAM device. The eight-pin WL-CSP is an additional package variant to the existing product MB85RS1MT. In comparison to the industry standard SOP-8 package, the WL-CSP package, which measures 3.09x2.28x0.33mm, reduces the surface mounting area by 77% and the device height by 80%.