Memory

As artificial intelligence (AI) processing moves from the cloud to the edge of the network, battery powered and deeply embedded devices are challenged to perform AI functions, like computer vision and voice recognition. Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, is addressing this challenge.

SMART Modular Technologies has announced that it is showcasing its Open Memory Interface (OMI) DDR4 Differential DIMM (DDIMM) at this week’s 2019 Flash Memory Summit in Santa Clara, California. SMART Modular joined a growing roster of technology organisations (in August) contributing to the OpenCAPI Consortium, working collaboratively to drive data centre server innovation.

Greenliant has started sampling its NVMe M.2 ArmourDrive Solid State Drive (SSD) modules to customers requiring high performance, high capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2 ArmourDrive SSDs use 3-bits-per-cell (TLC) 3D NAND flash memory and are built in the widely used 2242 and 2280 form factors.

  Toshiba Memory has announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH. Based on the company’s innovative BiCS FLASH 3D flash memory technology with 1bit-per-cell SLC, XL-FLASH brings low latency and high performance to data centre and enterprise storage.

In this video, Jay Bennett, Product Marketing Manager from Microchip explains that the company is entering the memory infrastructure space with the first member of the smart memory controller product family, the SMC 1008.

Swissbit will be returning to Flash Memory Summit (FMS) in Santa Clara, California from 6th to 8th August, 2019. During the show, Swissbit will be showcasing its latest 3D-NAND-based industrial storage product range (X 75) in conference room #208. Swissbit will also be presenting memory cards with integrated security features and demonstrating the concept of a net-policy-server for control and management of flash memory as an authentication ...

Apacer is adding a new series to its comprehensive product line. The 3D TLC SV250 SSD is now available for buyers who need the highest performance in industrial applications. Made with original ICs from Toshiba, it offers capacities from 30GB to 960GB, and up to 3,000 P/E cycles. It has impressive sequential read/write speeds of 560 and 520MB/s, respectively. 

  3D-NAND-based SSD’s are common in consumer markets. Swissbit has introduced a range of 3D-NAND-SSD products that are specifically optimised for demanding industrial- and NetCom applications. The X-75-range includes product versions with 2.5” housing, as well as m.2-, SlimSATA- and mSATA-modules.

imec has presented TEMPO: a cross-border collaboration between 19 research and industrial partners, funded by ECSEL Joint Undertaking which supports public-private partnerships in the EU. The three-year program aims at developing process technology and hardware platforms leveraging emerging memory technologies for neuromorphic computing for future applications in mobile devices that need complex machine-learning algorithms.

Toshiba Memory Europe has announced that it will officially change its name to Kioxia Europe on 1st October, 2019. The name Kioxia (kee-ox-ee-uh) will be adopted for the names of all Toshiba Memory companies, largely effective on the same date. Kioxia is a combination of the Japanese word 'kioku' meaning 'memory' and the Greek word 'axia' meaning 'value'. Merging 'memory' with 'value', Kioxia represents the company’s mis...