Memory

Distrelec has rapidly expanded its range of memory IC’s with Alliance Memory. Alliance Memory manufactures memory products that are pin for pin drop-in replacements for brands such as Micron, Samsung and Hynix. The brand’s product portfolio includes a full range of 3.3 and 5V asynchronous SRAMs used with mainstream digital signal processors (DSPs).

With the Mercury+ XU9 MPSoC module, FPGA specialist Enclustra presents the sixth SOM family based on the Zynq UltraScale+ MPSoC from Xilinx. To achieve the highest possible memory bandwidth, it is equipped with two memory banks: a 64-bit wide DDR4 SDRAM (up to 4 GBytes) connected to the PL and a 72-bit DDR4 ECC SDRAM (up to 8 GBytes) connected to the PS. Thus, the module achieves a memory bandwidth of up to 38.4 GByte/sec. 

Marvell has announced an expansion of its NVMe over Fabrics (NVMe-oF) portfolio. The solutions include one powering the Toshiba Memory native NVMe-oF Ethernet solid state drive (SSD) with Marvell’s NVMe-oF SSD converter controller, delivering direct-to-Ethernet SSD.

Since their introduction in the 1990s, memory cards have remained among the most successful, trusted and low-cost storage solutions available. Consumer memory cards are cheap and commonly used to store images, videos, audio and text in portable devices such as cameras and smartphones.

HCC Embedded (HCC) has announced its collaboration with Adesto Technologies to support the new Adesto FusionHD serial flash technology. HCC’s field-proven file system products use the features of FusionHD devices to significantly improve performance and data retention, reliability, and battery life of smart IoT devices.

Macronix International has announced that Macronix’s ArmorFlash memory is being utilised on the NVIDIA DRIVE AGX Xavier and DRIVE AGX Pegasus autonomous vehicle computing platforms. ArmorFlash brings secure, quality, and longevity of supply data storage to the demanding, competitive market for artificial intelligence (AI)-based Level 2+ advanced driver assistance systems (ADAS) through Level 5 autonomous driving (AD) solutions.

Toshiba Memory Europe has announced that a VMware vSAN 6.7 certification has been earned for its RM5 Series of value SAS SSDs running on HPE ProLiant Gen10 servers. The 12 gigabits per second (Gb/s) RM5 Series with VMware vSAN 6.7 and VMware ESXi 6.7 certification is now listed in the VMware Compatibility Guide and available through the same channels in which HPE ProLiant servers are sold.

BittWare, a Molex Company, has announced a strategic investment and collaboration with Eideticom. The BittWare Computational Storage portfolio adheres to industry standard PCIe, U.2 and EDSFF form factors.

Winbond Electronics has announced that its SpiStack dual-die NOR+NAND code storage product has been included on NXP Semiconductors FRWY-LS1012A board for use with its Layerscape LS1012A communications processor.

As the computational demands of artificial intelligence (AI) and machine learning workloads accelerate, traditional parallel attached DRAM memory has presented a major roadblock for next-generation CPUs, which require an increased number of memory channels to deliver more memory bandwidth.