Memory

Microchip has announced the introduction of the SST26VF Serial Quad I/O (SQI) 3V Flash family, according to the company, it is the industry’s first NOR Flash devices tooffer integrated MAC address options. Pre-programmed with EUI-48 and EUI-64 addresses, the devices do not have a minimum order requirement, providing cost effective, plug-and-play storage solutions for connected applications that use Ethernet, Bluetooth, W...

‘Factories of the future’ (FoF) is the European Union’s €1.15bn public private partnership for advanced manufacturing and production. It is the collaborative integration of Information Communicational Technology (ICT) and Automation Technology (AT) that has shifted the diverse manufacturing landscape. 

Kontron has introduced the new SMARC-sXAL4 module. The module is available with either Intel Atom, Intel Pentium or Intel Celeron processors of the latest generation. With dimensions of only 82x50mm, it can be used flexibly, and the E2 version is designed for use in an extended temperature range from -40 to +85°C.

Renesas has announced it has developed an AI accelerator that performs CNN (Convolutional Neural Network) processing at high speeds and low power to move towards the next generation of Renesas embedded AI (e-AI), which will accelerate increased intelligence of endpoint devices. A Renesas test chip featuring this accelerator has achieved the power efficiency of 8.8 TOPS/W (Note 1), which according to the company, is the industry's highest cla...

Despite some cyclicality and seasonality, the stand-alone memory market has experienced extraordinary growth over the past decade. This has been driven by important megatrends, such as mobility, cloud computing, AI, and IoT.

Winbond Electronics has announced the launch of a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memory product in a compact 8.0x9.5x0.8mm multi-chip package (MCP). The new W71NW20KK1KW product, combines robust Single Level Cell (SLC) NAND Flash and high-speed, low-power LPDDR4x memory.

Using the Arduino Platform and basic coding, in this video from Digi-Key, Robin shows how it possible to store data on a serial EEPROM memory chip with the I2C serial bus. 

Data Device Corporation (DDC) has introduced what is believed to be the first CCGA Rad-Hard DDR2 SDRAM for space applications, the latest addition to DDC's wide range of high density space grade ceramic hermetic memories, spanning Flash (NAND/NOR), SDRAM, SRAM and EEPROM solutions.

Data is interwoven into the fabric of our lives, regardless of how much or little we personally interact with the digital world. Successful, reliable and long-term data storage ensures that everything, from massive data centres and AI platforms down to menial wireless sensors and even our kitchen appliances, continue to function around us. And it is flash silicon-based memory technology that is increasingly being chosen to make this possible.

Supplier of advanced semiconductor solutions, Renesas Electronics, has announced the development of a new flash memory technology that achieves larger memory capacities, higher readout speeds, and over-the-air (OTA) support for automotive microcontrollers (MCUs) using the next-generation 28nm process.