Memory

With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand.  

Newly released support for Microsemi FPGAs and SoCs on ASSET InterTech’s ScanWorks can dramatically decrease programming times for SPI flash memory devices to the point where inline programming on the assembly line will not disrupt the manufacturing beat rate.

The PRU is a scalar processor, processing each instruction sequentially. With the exception of memory read instructions, all PRU instructions execute in a single cycle. However, the execution time of PRU read instructions varies based on memory access latencies.

Alliance Memory has announced that it has expanded its product offering with a new line of high-speed CMOS DDR4 SDRAMs. For improved performance over previous-generation DDR3 devices, the 4Gb AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.

A line of high-speed CMOS DDR4 SDRAMs has been released by Alliance Memory. For improved performance over previous-generation DDR3 devices, the 4Gb AS4C256M16D4 and AS4C512M8D4 offer lower power consumption and faster data transfer rates in 96-ball and 78-ball FBGA packages.

Adesto Technologies and Cadence Design Systems have announced they have collaborated to expand the ecosystem around the Expanded Serial Peripheral Interface (xSPI) communication protocol to enable higher transfer rates and lower latency for flash memory in internet of things (IoT) devices.

A new line of 5V parallel NOR Flash memory products in boot and uniform sectored architectures has been introduced by Alliance Memory. Available in densities from 1M to 16M, the devices offer access times of 55ns to enable fast, low-latency read speeds, allowing for both direct code execution and data storage in a single memory product.

HCC Embedded (HCC) has introduced SafeexFAT, its failsafe, RTOS-independent exFAT file system implementation that provides an easy integration for device manufacturers who demand the utmost in storage reliability for their deeply embedded applications. This is particularly important for manufacturers of devices where loss of data could be detrimental, such as in automotive, industrial, and medical applications. 

Toshiba Electronics Europe has announced the addition of new 16TB helium-sealed models to both the N300 NAS Hard Drive and X300 Performance Hard Drive Series. The 16TB models offer 14% more capacity than 14TB models. The 16TB models also double the buffer size of the 14TB models, increasing from 256MiB to 512MiB.

The era of intelligent IoT is just around the corner. As 3D NAND Flash memory cements itself as a core part of this technology suite, PCIe and NVMe are becoming dominant due to their rapid, reliable transmission speeds. SSDs with these ports are rapidly going mainstream.