Memory

STMicroelectronics has introduced a new generation of memory chips that combine storage density with speed and reliability, enabling the devices we use every day to do more to enrich life and work. With 4Mbit capacity, ST’s new EEPROM memories let small devices capture and store more data through the serial SPI bus. 

Karamba Security has announced a collaboration with Winbond Electronics Corporation to enhance embedded software security in automotive and other connected industries. OEMs and tier ones use Karamba’s embedded cyber security solutions for connected systems to protect their software and reduce vulnerability exposures.

The next generation of automotive systems are hungry for more. More advanced infotainment and ADAS systems. More storage for event data recording. Support for more 3D mapping. In a move that makes ‘more’ a reality, KIOXIA Europe (formerly Toshiba Memory Europe) has announced that it has begun sampling the industry’s first 512GB Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory so...

SMART Modular Technologies, a subsidiary of SMART Global Holdings, is set to showcase its DDR4 NVDIMM solutions along with its entire line of specialty memory products for AI and ML applications at SuperComputing 2019, Colorado Convention Centre, Denver, CO. SMART will be located within the Penguin Computing booth #1343.

Data centre administrators and IT managers want the ability to securely manage and trouble-shoot platforms and devices remotely, which requires that additional software, hardware and firmware be interfaced with storage adapters and other server components.

Apacer has announced the release of the XR-DIMM. This rugged memory module claims to be the first on the market to meet the exacting standards of the US RTCA DO-160G test, an aviation equipment certification that marks the XR-DIMM as resistant to high levels of vibration and therefore well suited for defence and aeronautical applications. 

Rambus has announced a broad portfolio of high-speed memory and SerDes PHYs for next-generation applications on TSMC’s industry-leading N7 process technology. Rambus offers GDDR6, HBM2 and 112G LR PHY IP available for licensing, these solutions enable demanding applications for data centre, networking, wireless 5G, HPC, ADAS, AI and ML.

Newly released support for Microsemi FPGAs and SoCs on ASSET InterTech’s ScanWorks can decrease programming times for SPI flash memory devices to the point where inline programming on the assembly line will not disrupt the manufacturing beat rate. ASSET InterTech is a leading supplier of JTAG-based software and hardware debug, validation and test tools.

NAND Flash has become a mature technology, and the varieties of formats that are now available are already adopted in many industrial applications. However, with the desire to go beyond the standard options, Apacer has developed certain optimisations of NAND Flash technology. 

When designing circuits with DDR3 SDRAM modules, developers need solutions for checking the signal integrity on high-speed data lines. The new R&SRTO-K91/ R&SRTP-K91 oscilloscope option offers several tools - decoding of read and write cycles, display and analysis of eye patterns, and automated compliance testing for the DDR3, DDR3L and LPDDR3 standards.