Memory

Rambus has announced that Enflame (Suiyuan) Technology has selected Rambus HBM2 PHY and Memory Controller IP for its next-generation AI training chip. Rambus memory interface IP enables the development of high-performance, next-generation hardware for leading-edge AI applications.

IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2020, which will be released in January 2020. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organisation (WSTS) through the year 2024. The top five categories for IC product growth are covered in th...

At this year’s IEEE International Electron Devices Meeting, imec, reported an in-depth study of scaled transistors with MoS2 and demonstrated best device performance to date for such materials. MoS2 is a 2D material, meaning that it can be grown in stable form with nearly atomic thickness and atomic precision. Imec synthesised the material down to monolayer (0.6nm thickness) and fabricated devices with scaled contact and channel length...

KIOXIA Europe has announced the development of the first three-dimensional (3D) semicircular split-gate flash memory cell structure 'Twin BiCS FLASH' using specially designed semicircular Floating Gate (FG) cells. Twin BiCS FLASH achieves programme slope and a larger programme/erase window at a much smaller cell size compared to conventional circular Charge Trap (CT) cells.

Aldec has launched a powerful, versatile and time-saving FPGA-based NVMe Data Storage solution to aid in the development of High Performance Computing (HPC) applications such as High Frequency Trading and Machine Learning.

Four years after bringing the first DRAM with on-chip ECC in DDR1, DDR2 and DDR3 technologies to the market, Intelligent Memory is expanding the product line again adding a new series of LPDDR4(X) memory components with integrated ECC error-correction capability.

Memphis Electronic has announced that it is now sampling 32GB DDR4 modules for industrial applications. Many of today’s CPUs are designed to support up to 32GB of unbuffered DDR4 per available UDIMM or SO-DIMM slot, until now, such high density modules have been rarely available on the market. 

Renesas Electronics has implemented Macronix’s dedicated OctaBus to support Macronix 8 I/O octaflash Memory MX25UW51245G, octaram and octamcp products on the Renesas RZ/A2M group of high-end Arm-based microprocessors (MPUs) and its evaluation boards for high-speed processing of e-AI imaging in smart appliances, service robots, and industrial machinery.

Following on its successful debut appearance last year Alliance Memory returns to embedded world in Nuremberg (February 25-27, 2020) to highlight its SRAM, pseudo SRAM, NOR Flash, and DRAM memory ICs for embedded communications, telecom, and consumer electronics, the company will feature a range of products of interest to European customers.

  Microchip has announced a new family of Serial Peripheral Interface (SPI) EERAM memory products that offers system designers up to 25% cost savings over the current serial Non-Volatile RAM (NVRAM) alternatives. The family introduces four reliable SPI densities to Microchip’s EERAM portfolio, ranging from 64Kb up to 1Mb.