Memory

As we demand more mobility and instant access, we need bigger, faster, and more efficient data centers to serve up the content. Can non-volatile memory successfully extend its position as the technology of choice in mobile devices, to high performance computing? Find out as we explore more in this article from ES Design magazine.

Corsair today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64GB and speeds up to 2933MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family and previous generation Intel and AMD platforms.

Toshiba Corporation today announced that the development of the world's first MROM cell to offer improved cell current characteristics without any increase in cell size. This advance was achieved by adopting a multi-level-cell structure, which also secures high speed operation.

SK Hynix announced that it has developed the world’s first 8Gb LPDDR3 using its advanced 20nm class process technology. This product is a top-performance mobile memory solution which features high density, ultrahigh speed and low power consumption.

Rochester Electronics has re-introduced and continues to manufacture the X28HC256DM-12 low power CMOS EEPROM, originally manufactured by Intersil. It supports a 128-byte page write operation, providing a 24 micro-second/byte write cycle, and enabling the entire memory to be rewritten in less than 0.8 seconds. For a continuous authorized source on this product series, check inventory here.

Adesto Technologies today announced the launch of the DataFlash “E”-series, a new family of non-volatile memory devices with lower power requirements and smart features for higher system efficiency and lower system costs. At introduction, the family includes 2 Mb, 4 Mb, 16 Mb and 32 Mbit memory devices, with 8 Mb and 64 Mb devices in development.

ADATA Technology today launched a successor to the company’s popular XPG DRAM lineup. The new XPG V2 series are designed for 3rd Generation Intel Core Processors and the Z87 platform, and feature colorful and visually striking heat spreaders. The XPG V2 modules all feature 2oz copper, 8 layer PCB aluminum heat spreaders employing Thermal Conductive Technology.

Alliance Memory today expands its line of legacy high-speed CMOS SRAMs with two new 16M ICs. Featuring fast access times of 10 ns, the AS7C316096A (2048K x 8) and AS7C316098A (1024K x 16) are both offered in the 48-pin, 12-mm by 20-mm TSOP-1 package.

Crucial today announced new Crucial Ballistix Sport SODIMMs, designed to boost performance of gaming laptops, all-in-one systems, or mini ITX motherboards. Featuring XMP profiles for easy configuration and DDR3 speeds up to 1866MHz, Ballistix Sport SODIMMs deliver a faster and more responsive gaming experience.

Microchip Technology introduce a family of serial EEPROM devices that feature a unique, pre-programmed 32-bit serial number for customers requiring unique IDs in their applications. For applications needing longer than 32-bit IDs, the unique ID can be extended to 48-bit, 64-bit, 96-bit, 128-bit and other lengths by increasing the number of bytes read from memory. Because the 32-bit ID is unique within these devices, any longer bit sequence is als...