Design

Danisense is enhancing its R&D capabilities with the integration of new state-of-the-art winding machines into its rapid prototyping setup.

Arteris has announced the immediate availability of the latest generation of Magillem Registers technology for SoC integration automation.

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices.

Baya Systems and Semidynamics have announced a collaboration to boost innovation in development of hyper-efficient, next-generation platforms for AI, ML and HPC applications.

Efficient Computer announced the launch of its new effcc Compiler Playground. For the first time, developers can apply for Efficient's Early Access Program for the Playground to experience the performance of the company's energy-efficient processor.

Lauterbach extends the range of Arduino supported boards and devices. Following the successful integration with the Arduino Pro Portenta H7, Nano 33 BLE, Nano 33 BLE Sense and Nicla Vision, TRACE32 now adds support for the Arduino GIGA R1 Wi-Fi and Arduino Opta.

This week at SPIE Advanced Lithography + Patterning, imec presents the first electrical test results obtained on 20nm pitch metal line stuctures patterned after single-exposure High NA EUV lithography.

Imagination Technologies announces its latest GPU IP, Imagination DXTP, which sets a new standard for the efficient acceleration of graphics and compute workloads on smartphones and other power-constrained devices.

High-speed electronic devices that do not use much power are useful for wireless communication. High-speed operation has traditionally been achieved by making devices smaller, but as devices become smaller, fabrication becomes increasingly difficult. Have we reached a dead end?

Now being shipped by authorised distributor Mouser Electronics is the FRDM i.MX 93 development board from NXP Semiconductors.