Design

Researchers at Tufts University have developed the first web-slinging technology capable of shooting a fluid material that solidifies into a string on contact with air, adhering to and lifting objects.

Codasip has announced its new L730 core. Codasip L730 is a high-quality, high-performance embedded core that meets automotive safety and security needs enabling ISO/SAE 21434 and ISO 26262 compliance up to the ASIL D integrity level.

Arteris, Inc. announced an innovative evolution of its network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development of artificial intelligence (AI) and machine learning (ML) compute in system-on-chip (SoC) designs.

Alan Anderson Manufacturing (AAM), the UK's newest full-service provider of PCBA and Value-Add Contract Electronics Manufacturing (CEM), has recently installed advanced conformal coating equipment at its UK facility. 

Lauterbach and Kernkonzept enable architects of virtualised software systems to start development and testing on future RISC-V platforms even before corresponding System-on-Chips (SoCs) are available in silicon.

Kurtz Ersa has announced a new partnership with Interflux Singapore, further expanding its range of soldering solutions. 

SHENMAO has announced the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates.

SolderKing Assembly Materials is celebrating six years of growth and success in the electronics and industrial manufacturing sectors.

Pulsonix announces the 2024 release of Pulsonix - Version 13.0.

Lauterbach extends their TRACE32 debug and trace tools to include support for Synopsys’ RISC-V instruction set based ARC-V processor IP. This support includes full debug and trace of the ARC-V processor IP, including those on vendor-specific hardware implementations, support for virtual targets and TRACE32 Instruction Set Simulators (ISS).