Design

A new Lithium Manganese Iron Phosphate (LMFP) cathode active material developed by Integrals Power could increase the real-world range of electric vehicles (EVs) by extending the useable capacity of the battery under high discharge conditions.

To make its robust programming and debugging capabilities accessible to a wider range of engineers, Microchip Technology has launched the MPLAB PICkit Basic in-circuit debugger to be a cost-effective, powerful solution for engineers at various levels.

Qoitech continues to innovate in embedded system testing with the latest firmware update for Otii Ace Pro, now featuring battery charging emulation.

Pragmatic Semiconductor has announced the launch of Pragmatic FlexIC Platform Gen 3, offering a 10x digital power and 3x digital area improvement over the previous generation. 

Semidynamics has announced its support for the ONNX Runtime and the availability of its RISC-V Software Development Kit (SDK), Aliado.

Here, Patrick Faulkner, Lead Engineer at Accu, explores the key differences between thermosetting plastics and thermoplastics and why it’s important for engineers to choose the right material for specific electronics applications.

CTX will present its high-performance cooling solutions for IPCs and embedded systems at this edition of embedded world.

Danisense is enhancing its R&D capabilities with the integration of new state-of-the-art winding machines into its rapid prototyping setup.

Arteris has announced the immediate availability of the latest generation of Magillem Registers technology for SoC integration automation.

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices.