Design

High-speed electronic devices that do not use much power are useful for wireless communication. High-speed operation has traditionally been achieved by making devices smaller, but as devices become smaller, fabrication becomes increasingly difficult. Have we reached a dead end?

Now being shipped by authorised distributor Mouser Electronics is the FRDM i.MX 93 development board from NXP Semiconductors.

DISPLAY VISIONS launches a series of OLED displays equipped with pins for contacting purposes. The new displays are simply soldered into the circuit board without the need for error-prone plug connections. Sample devices and small series can be made easily and inexpensively by plugging them into a suitable socket or on the breadboard.

Arteris has introduced FlexGen, a smart network-on-chip (NoC) interconnect IP. FlexGen from Arteris dramatically accelerates chip development while optimising performance efficiency, addressing the rising demand for faster, more sustainable innovation in automotive, datacentre, consumer electronics, communications, and industrial applications.

To help manufacturers address the rising demand for bonding low surface energy (LSE) materials, such as polypropylene and polyethylene, adhesive specialist Intertronics presents SCIGRIP SG400LSE Methyl Methacrylate Adhesive (MMA).

Siemens Digital Industries Software has announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens advanced packaging integration solutions.

Advanced Rework Technology Ltd (A.R.T) together with electronics manufacturing trade association, IPC, has named Justyna Mikolajczyk, a technician and veteran electronics assembler with inductive position sensor manufacturer, Zettlex (part of Celera Motion, a Novanta company), as the IPC UK Hand Soldering Champion.

Researchers at the University of Waterloo have unlocked the potential of graphene in areas as diverse as vehicles, consumer electronics, and environmental cleanup with an eco-friendly ink for 3D printing.

A new form of energy-efficient artificial vision system inspired by the human brain and made in part using honey could help reduce the impact of electronic waste.

Scientists, including an Oregon State University chemistry researcher, have taken a key step toward next-generation optical computing and memory with the discovery of luminescent nanocrystals that can be quickly toggled from light to dark and back again.