Design

For the first time, researchers at the University of California, Irvine, alongside international collaborators, have achieved atomic-scale observations of grain rotation within polycrystalline materials. These materials, fundamental to electronics, aerospace, automotive, and solar technologies, have long intrigued scientists due to their unique structural dynamics.

Researchers at the University of Michigan developed a knee exoskeleton, using readily available knee braces and drone motors, to alleviate fatigue in lifting and carrying tasks.

The future of space travel is seemingly changing by the day and a Coventry University academic is doing his bit to stay at the front of the space race.

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: with the use of UV-curable moulding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimises the energy consumption.

KYOCERA has further developed its high-end ceramic Starceram N3000 P and has launched a new silicon nitride for the functional testing of next-generation microchips.

Mouser Electronics, in collaboration with eeDesignIt, presents Circuit Showdown, a design competition that brings aspiring engineers together for a one-of-a-kind showdown.

Researchers at the German Primate Centre – Leibniz Institute for Primate Research in Göttingen have developed a new training protocol for brain-computer interfaces (BCIs), achieving a significant advancement in prosthetic hand control.

Silk has long been revered for its luxurious qualities and historical significance as a valuable commodity. Now, researchers are discovering new potential for silk in microelectronics, paving the way for advancements in computing and wearable technology.

In modern electronic devices, the way electrical signals travel is crucial to their performance. However, as signals move through metal conductors, they naturally lose strength due to the resistance in the material.

At the International Astronautical Congress in Milan, Italy, Axiom Space and Prada unveiled the flight design of the Axiom Extravehicular Mobility Unit (AxEMU) spacesuit for the first time.