Component Management

  Automation solutions for all forms of Thermal Interface Materials (TIMS) are offered by Laird Performance Materials (LPM). The company offers dispensable gap fillers, printed thin gap TIMs (TIM Print), ‘robotic motion control’ placed thick –gap TIMs (TIM Pick). 

TIM Print is a novel method to apply Laird Performance Materials’ thermal management die cut pads while reducing total cost of ownership. It offers a more robust, reproducible and reliable application process as compared to traditional ‘peel and stick’ and dispensing methods.

A new method has been introduced to apply Laird Performance Materials’ thermal management die cut pads while reducing total cost of ownership, with the TIM Pick. It offers a more robust, reproducible and reliable application process as compared to traditional ‘peel and stick’. TIM Pick uses robotic motion control with an innovative ‘pick head’. 

An additive electronics provider, Nano Dimension, has announced it has successfully printed and tested an Internet of Things (IoT) transceiver, an additively manufactured IoT device. Using its DragonFly Pro precision additive manufacturing system, Nano Dimension reportedly printed a transceiver prototype in 12 hours with improved performance over traditional manufacturing.

Plumbing the depths of reflow technology with the specialist books of Dr Hans Bell (Rehm Thermal Systems): in the wake of four successful volumes, the publication of the fifth marks the final part in the Rehm series ‘Reflow technology – Fundamentals of Reflow Soldering’. 

Thermaltronics announced that it was awarded a 2019 EM Asia Innovation Award in the category of Soldering Systems - Soldering Robot for its TMT-R9800S Solder Robot. The award was presented to the company during a ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The company also has been recognised by the 2018 Global Technology Awards, 2019 NPI Awards, and 2019 SMT China Vision Awards for its TMT-RS9800S ...

Contaminants, such as oxides, water, organic substances and dust, often cover a surface in layers due to natural exposure in air. While the surface may appear clean to the human eye, such contaminants can impair further treatment such as bonding, printing, painting or coating. Here Peter Swanson, Managing Director of Intertronics discusses plasma cleaning technology and its benefits.

A single component, nanosilica filled compound featuring a UV and heat curing mechanism has been released by Master Bond, with the UV22DC80-1Med. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry. 

Let's start from the begining, the earliest PCBs were very much works of art. Etched by hand, they owed more to technology from artwork reproduction than to high tech. To create these circuits copper-clad boards were used. The artwork was hand-drawn, and once the track layout was defined, it was printed onto the board as an etch-resist mask. Acid was next used to etch away the exposed copper before another chemical removed the etch...

To meet application specific requirements, design engineers in industries that manufacture sensitive components often need more flexibility than standard options allow for automating wet process cleaning equipment. These specialised components can range from chips, wafers, semiconductors, and electronic devices to the specialised optics for world-class lasers.