Component Management

The cleaning agents of the VIGON PE Series for Power Electronics have been successfully established in the market and are reportedly qualified by leading power module manufacturers. Each cleaning agent provides good cleaning performance and reliably removes flux residues from power modules/DCBs after die attach or heat sink soldering. 

Producer of speciality graphene materials, Applied Graphene Materials (AGM), has signed a distribution agreement with Carst & Walker (C&W) that will extend the Company’s commercial reach into the South African chemical markets. C&W are part of Hobart Enterprises, who operate across multiple global markets.

  Intertronics is now offering new products in the Dymax MX-Series of high intensity LED UV curing lamps. The products offer manufacturers the flexibility to tailor their LED UV curing systems to their needs, by offering three different emitter patterns, as well as three different wavelengths - 365, 385 and 405nm.

A global specialist in silicones and silicon-based technology, Dow, has further expanded its portfolio of protective pottants with the launch of new, heat-resistant dielectric gels under the DOWSIL label: EG-4000, EG-4100 and EG-4120. The latest additions are thermally stable silicone pottants for protective encapsulation of sensitive components within SiC and GaN power modules, on PCBs and in industrial sensors and actuators.

  The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.

A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.

A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.

It has been announced that Ellsworth Adhesives are now taking orders for the newly-launched Dowsil (Dow) EI-2888 Primerless Silicone Encapsulant. Dowsil EI-2888 is an optically clear encapsulant designed for professional LED lighting applications. The 100% silicone encapsulant provides LEDs with essential protection from moisture and surface contaminants. 

Total process solutions provider for advanced photonics, Palomar Technologies, has announced that SST Vacuum Reflow Systems, has launched the SST 8300 Series Automated Vacuum Pressure Soldering System. The series, consisting of single and triple chamber systems provides a reliable solder connection with a better than industry standard void rate, a key to delivering high-reliability power modules for automotive and commercial applications. 

At the Battery Show Europe 2019 (Hall 1, Stand 349), Dow introduced the new DOWSIL EC-6601 Electrically Conductive Adhesive, a next-generation material engineered for reliable performance and electromagnetic compatibility (EMC) in demanding electrical and electronics applications in the transportation, communications and consumer markets.