Component Management

The versatile new Microcare General Purpose Cleaner and Adhesive Remover is now available to order from Ellsworth Adhesives Europe. The multi-purpose cleaning system replaces the discontinued Slow Drying Flux remover (MCC-E7M) due to high demand.

Indium Corporation will feature its Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28th to 30th in Taipei, Taiwan. The use of high-power LEDs, MicroLEDs, and MiniLEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.

Master Bond EP21TP-2NV is a two part epoxy polysulfide hybrid formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting RoHS3 Directive (EU) 2015/863. 

In modern industry, programmable tools play a key role due to their high repeatability and reliability. Whenever you want to manufacture a precision component like a bracket or bushing, you need to design and create that component, paying attention to the smallest details. This is why CNC (Computerised Numerical Control) machine tools are so popular - they enable fast and cheap production of precision components. Transfer Multisort Elektronik (TM...

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilised for encapsulation and bonding. Supreme 3CCM-85 cures within two to three hours at 80-85°C, which is advantageous for use on heat sensitive components and substrates. 

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume. 

Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.

Electrolube will host two technical workshops at the WNIE show, on the 18th and 19th September at the NAEC in Stoneleigh, Warwickshire.Development Chemist for Electrolube’s Conformal Coatings Division,Beth Turner MSc, will provide a complete overview of conformal coatings through two conclusive workshops on both days of the event.

The UK adhesives supplier, Techsil, has launched a range of new adhesive products with low ion content which cure with UV, visible light or moisture. Developed by manufacturers Panacol, these products were specially formulated for applications in the electronics and consumer electronics industry, where heat sensitive parts need to be assembled.

Upon customer request, LASER COMPONENTS can coat substrates with diameters of up to 390mm, including, for example, wafers that are required in microchip manufacturing and other industries. The blanks may consist of silicon, fused silica, N-BK7, or other glasses.