Component Management

EVS International will exhibit in Booth #1132 at SMTA International, scheduled to take place September 24th to 25th, 2019 at the Stephens Convention Center in Rosemont, IL. The company will show the EVS 500LF Solder Recovery System. The EVS500 LF offers improved performance and cost savings.

MacDermid Alpha Electronics Solutions has launched the ALPHA HiTech series of Underfills, Cornerfills, and Low Temperature Adhesives for increased reliability of assembled electronic packages. ALPHA HiTech Low Temperature Adhesives are one component, halogen-free, heat-cured formulations supporting processing as low as 80°C.

Operatives and engineers who want to ensure solder efficiency can now access a soldering tip selector just launched by Farnell. The easy-to-use selector helps customers choose the right tip for over 100 different soldering systems and stations, from 1,500 tips in stock all available from Farnell for next day delivery.

When dispensing small amounts of two-part adhesives or other materials, two key considerations are whether the material is mixed correctly and the accuracy of the amount dispensed. Here Paul Whitehead, Key Account Manager at Intertronics, shares his thoughts on the precise metering, mixing and dispensing of small amounts of two-part materials.

TE Connectivity (TE), a world leader in connectivity and sensors, has introduced new self-adhesive polyester rating labels, PR115. These custom-designed labels have UL969 category PGJI2 file MH29684 approval, which means that they can be printed by end-use product manufacturers using thermal transfer equipment. 

Much time and planning are invested in the choice of the ideal conformal coating material and process to adequately protect your printed circuit boards. This often includes multiple qualification trials. There is also what can be long and detailed testing in areas such as electrical performance, flame resistance, and thermal or mechanical cycling.  By Matt Eveline, HumiSeal

Techsil have launched a new potting compound for electronics with medium viscosity and small filler particle size: Structalit 5894-1 is the perfect choice for large-volume potting or glob top sealing of power electronics. Structalit 5894-1 is a black, one part epoxy resin which requires no mixing.

Greene Tweed has introduced its innovative ArlonÒ 3000 XT thermoplastic for electronics applications. The ArlonÒ 3000 XT provides a high level of thermal stability and chemical resistance, very low moisture absorption, remarkably low wear, and high impact resistance.

Xylene and Toluene. Two words that can evoke concern and add to paperwork for environmental health and safety departments and manufacturing professionals. Aromatic solvents have been safely used for decades by employing basic safety equipment including gloves, masks, and proper workplace ventilation.  By Dan Griffin

  Manufacturers often choose light curing materials for assembly applications because of their bonding effectiveness, rapid cure time and process efficiencies. With so many adhesives and so much equipment on the market, where should manufacturers start? Here Peter Swanson, Managing Director at Intertronics, shares three tips for manufacturers operating UV curing processes.