Component Management

Seika Machinery is now distributing the UNITECH UC-250M-CV PCB Board Cleaner.  The new cleaner uses a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system ensures better results than a single brush or adhesive roller system.

Assisting the company's “Total Line Solutions” sales strategy into LED and OEM accounts, Juki Automation Systems has introduced the RS-600 Six Zone Air and Nitrogen Reflow Ovens. As an added benefit, Juki is now including KIC AFP (Auto-Focus Power) as a standard feature on its line of reflow ovens. AFP gives the 'Best First Guess' when setting up a new product.

  Expanding the Trident family of fully automatic cleaning/defluxing systems, Aqueous Technologies has announced the Trident ZDO. This completely zero discharge system automatically washes, rinses, verifies cleanliness and fully dries assemblies within a single compact machine.

A guide focusing on thermal interface material dispensing has been published by Chomerics. The 16-page guide contains in-depth technical information to assist engineers seeking to use dispensable thermal interface materials in their end products and integrate them into the production process. 

A line of manual, pneumatic, and cordless guns for dispensing two-component adhesives has been introduced by Nordson EFD. Making dispensing even the thickest materials easier and less cumbersome, the guns' 26:1 thrust ratio enables a lighter touch to dispense more material with each trigger pull. 

Expanding their line up of Techspray Renew Eco-dFluxer inline and batch cleaner products, Techspray introduce the Eco-dFluxer SMT200 and Eco-dFluxer SMT300 defluxers. Offering increased cleaning performance, better metals compatibility and reduced environmental impact, the defluxers give you brilliant solder joints and allow you to increase dilution, increase line speeds, reduce waste water, decrease cost per board, and eliminate field failures d...

Replacing second generation 19nm process technology (the company's former flagship process), Toshiba has developed what it claims to be the world’s first 15nm process technology. The chips achieve the same write speed as chips formed with second generation 19nm process technology, but boost the data transfer rate to 533Mb/s, 1.3 times faster, by employing a high speed interface.

Featuring a tough polyimide carrier to fulfil demanding automotive and industrial applications, the high-durability Gap Pad 1000HD thermal material has been introduced by Bergquist. The polyimide carrier maximises puncture and tear resistance and enhances handling characteristics, while also ensuring high dielectric breakdown voltage of over 10,000V.

The first in a line of low-volatility dispensable thermal interface materials, Bergquist has introduced Gap Filler 1500LV. The two-component liquid dispensable thermal interface material is optimised for applications such as LED lighting where designers need to minimise fogging of lenses or optics.

The SlimKIC 2000 and KIC Explorer lines, from KIC, have been discontinued and will no longer be available for sale. The SlimKIC 2000 and KIC Explorer profilers will be replaced with the new K2profile setter, which enables profile viewing on mobile Android and Apple devices.