Component Management

A UV and visible light curing adhesive, particularly suited to rapid bonding of COP/COC, has been introduced by Intertronics. The DYMAX 1072-M MD adhesive bonds COC/COP (cyclic olefin polymers/copolymers) film laminates and other difficult-to-bond-to polymers, as well as a variety of other plastics widely used in the manufacture of medical devices.

  Scheduled from 3rd to 5th September 2014 in Taipei City, Taiwan, Kyzen will exhibit in booth 1226 at SEMICON Taiwan. The company will demonstrate the MICRONOX MX2302 wafer-level cleaning solution and the AQUANOX A4638 advanced packaging cleaning chemistry.

Curing in just 1-2 minutes at 149°C (300°F), the EP3SP5FL single component epoxy has been released by Master Bond. Suitable for a variety of applications in the electronic, aerospace and OEM industries, the manufacturer has stated that since it requires heat curing, it has an essentially  'unlimited' working life at room temperature.

An automated programming system, designated the PSV3000, has been introduced by Data I/O Corporation. Utilising the FlashCORE III programming engine, the PSV3000 combines the company's programming technology with intelligent system integration. Included in this is high quality pick and place technology and vision system which allows for precise alignment and placement.

  Creating a tighter seal between the piston and the fluid than other pistons in the market, Nordson EFD has announced that the Optimum Clear Flex Piston reduces bounce. This enables the dispensing solution to achieve more consistent results when dispensing viscous fluids.

Modern components with high clock rates and short switching times for high signal transmission rates require impedance matching for rigid-flex PCB technology. The impedance calculation, as well as the documentation and measurement of impedances is becoming increasingly important.

The introduction of a 1.0 mm thick sheet signals an expansion of Fujipoly’s Sarcon XR-Pe product offering. Conforming to most CPU and semiconductor shapes, the material offers thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.

  A rigid-flex PCB, which meets the material requirements of motorcycle sport, has been developed by Würth Elektronik with GCD-PCB-Design. These requirements include suitability for rapid pace, extreme load changes, summer heat and mud, dust and dirt. 

Cogiscan has announced a Genealogy module providing tracking, traceability and control of PCBAs (Printed Circuit Board Assemblies) through subsequent assembly levels to the finished product.

Based on the report 'Functional Materials for Supercapacitors / Ultracapacitors / EDLC 2015-2025', IDTechEx has forecast that the market for functional materials for supercapacitors will reach $5bn by 2025.