Component Management

  An LED flood system, manufactured by Dymax, has been released by Ellsworth Adhesives. Due to its instant on/off function, the BlueWave LED Flood System has no mechanical shutter components, no warm-up time requirements, faster exposure cycles, and lower maintenance costs.

Two new soldering station products recently launched by leading electronic production and assembly equipment manufacturer Weller are now available at Conrad Business Supplies. The design of the WSD 81i (80 W soldering iron) and WSD 81iSE (65 W soldering iron) has been optimised for user-friendly operation, precision, flexibility, safety and cost efficiency.

An improved Solder saver from Aprotec Instrumentation has been announed by their distributor Gen3 Systems. The Solder saver has been designed for use with leaded and lead-free wave soldering machines, with the company claiming that the ‘wave soldering’ the Solder saver offers can save up to 50% in new solder bar purchases.

  Two temporary solder masks have been introduced by Chemtronics. Chemask HT and Chemask Aqua are additions to the companies Chemask line of temporary solder masks. 

Using their elastomers and adhesives, Teknek have developed a cleaning solution for webs. The company hope to replace contact cleaning, which can cause micro-scratching, with the SCH, a gentler solution. This incorporates the Nanocleen high performance cleaning core in a small footprint and can handle webs of 1000-2200mm in width.

  Expanding the company's range of convection rework accessories, Metcal has announced the Solder Ball Placement Kit. This selection of tools was identified in order to enable the operator to rework small components with repeatability and consistency.

A low bio-persistent solution ideal for use in ceramics, glass and metals manufacturing processes, as well as in commercial automotive and consumer goods applications, has been introduced by Morgan Advanced Materials. Offering a low bio-persistent-solution, the Superwool fibre papers are non-wetting to molten aluminium and feature low thermal conductivity, excellent tensile strength, thermal stability, and resistance to chemical attack. ...

A ceramic-to-ceramic bonding technique, suitable for use in demanding and high-pressure fluid handling and vacuum applications, has been released by Morgan. Using a preparatory formulation applied to one or both faces of the parts to be joined, the bonding technique delivers high tensile strength.

  A vacuum-bonding assembly technology for TFT display structures, touchscreens and front glasses, has been introduced by Distec. VacuBond is suitable for the latest TFT generation which is more fragile than the last. 

A coating system for EMI/RFI applications, claimed to be high performing, has been developed by Master Bond. MB600G is a water-based, sodium silicate system with graphite filler, making it suitable for shielding applications such as those within the electronics and aerospace industries.