Component Management

Passing ASTM E595 testing for NASA low outgassing, MasterSil 920-LO is a high performance, room temperature vulcanising silicone for sealing, coating and small encapsulations. Introduced by Master Bond, this single component system has a moderate, flowable viscosity and a solid electrical profile, which makes it suited for conformal coating applications in the electronic and optical industries.

Electroplating Engineers of Japan, which operates the Tanaka Precious Metals Group's plating business, together with Professor Junichi Takeya, Graduate School of Frontier Sciences, University of Tokyo, has developed the world's first technology for the simultaneous formation of contact electrodes for p-type and n-type1 Organic-semiconductor Field Effect Transistors (OFETs) using an electroless plating process.

IRT Nanoelec and CMP are jointly launching a platform for Multi-Project-Wafer, post-process 3D integration (3D-MPW). The disruptive 3D configurations and assemblies created by this IRT Nanoelec/CMP initiative are designed to promote 3D integration. This service, the first of its kind, extends CMP’s regular MPW offer by using 3D post-process technologies at wafer level from IRT Nanoelec.

Intertronics has released Polytec PU 1000, a single part adhesive which cures quickly at room temperature to a flexible, electrically conductive polymer. It can replace traditional epoxies which are rigid and require thermal processing, offering production efficiencies and enabling applications where pliability and conductivity is important.

Mitsubishi Heavy Industries Plastic Technology has announced the D-LFT System, a kneading/injection moulding machine capable of forming high-strength Long-fibre-Reinforced Thermoplastic (LFT) products from glass fibres and PolyPropylene (PP) resin, all in one process. A screw shape and glass fibre feed method eliminate the need for kneaded pellets (compound), enabling manufacturing cost reductions.

The electronics division of Henkel has just announced the launch of temperature stable solder paste material, Loctite GC10, now available from Ellsworth Adhesives Europe. As the first material of its kind to boast temperature stability, the launch of Loctite GC10 marks a significant breakthrough in the solder paste market.

Researchers at the International Center for Materials Nanoarchitectonics, Tsukuba have uncovered the underlying structures and the behaviour of currents on the surface of Si(111) which provide clues to its superconductivity. Superconductors have effectively zero resistance and act as perpetual carriers of electric current with no need for a connected power source, giving rise to many applications in electronics.

According to a new market report published by Persistence Market Research ‘Global Market Study on Graphite: Battery Segment To Witness Highest Growth by 2020’, the global graphite market was valued at $13.62Bn in 2013 and is expected to grow at a CAGR of 3.7% from 2014 to 2020, to reach $17.56Bn in 2020.

A polyurethane resin system, which cures quickly and allows the production of high heat stable modelling, tooling and rapid prototyping boards, has been introduced by Huntsman. The VITROX EST system is suitable for the aerospace, automotive, marine and shipbuilding sectors. 

Isola Group has announced the introduction of Chronon, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs. The introduction of Chronon, which follows the 2014 launch of Gigasync, expands the company’s portfolio of PCB materials to mitigate skew in high-speed designs.