Component Management

Adding a sidewall patterning capability to its custom thin film substrate offering, Vishay Intertechnology can now provide conductive patterning on up to four surfaces with compact line width and gap dimensions, increasing design flexibility and density for miniaturisation in military, aerospace, medical and telecomms equipment.

Engineered Material Systems has introduced the DB-1541-S9 conductive adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallisation during damp heat exposure.

The SOI Industry Consortium announces silicon-on-insulator (SOI) technologies gaining strong industry momentum towards a rapidly growing SOI ecosystem. A robust foundry offer and leading fabless players are demonstrating how simple it is to design and manufacture ICs on Fully Depleted SOI (FD-SOI) and RF-SOI technologies, confirming SOI as a very competitive technology platform for fast-growing semiconductor applications.

Developed for speciality aviation applications, a two part epoxy system has been introduced by Master Bond. EP90FR-V passes the vertical burn test portion of the FAR standard 14 CFR 25.853(a) for flame retardancy, which enables it to be used in aviation applications including interior panels, door frame lining and floor/door assemblies.

Fujipoly’s Sarcon 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer and a low-tac surface treatment. This prevent die-cut holes from collapsing and help maintain original specification tolerances during final assembly. These material enhancements also reduce tearing, elongation and damage making your production operations faster and easier.

A complete line of nozzles for the Panasonic NPM machines are now available from Count On Tools. These nozzle designs enable highly accurate, repeatable, optimised chip placement. The NPM series equipment optimises the latest technologies into a lean modular solution for changing, expanding and evolving electronic assembly needs.

Essemtec has chosen booth B28, hall 1 at the upcoming AUTOMATICON 2015 exhibition, taking place 17th to 20th March in Warsaw, as the location to highlight its Paraquda combined SMT production centre, able to jet solder paste and/or glue and mount components. One machine platform processes all types of components, from 01005 to large components or connectors.

Photo Stencil has expanded its stencil manufacturing process with the addition of Laser Direct Imaging (LDI) capabilities. The new equipment enables Photo Stencil to transfer intricate patterns, fine lines, and small dots that are necessary for high density interconnects, BGAs, CSPs, and flex circuits, onto a substrate to create an extremely accurate stencil that can be used for solder paste printing of PCBs.

The adhere IRS 2129 rubber modified adhesive from Intertronics is a high performance black rubber modified resin system, designed for the bonding of dissimilar materials with differing rates of thermal expansion to provide a tough and resilient joint. This includes many substrates, including rubber, found in applications such as electronics, electrical and other specialist component assemblies, e.g. automotive and specialist vehicles.

Manncorp has announced the IS-T-300, an all-in-one selective fluxing and soldering system designed to deliver outstanding quality and consistent, efficient performance. Suitable for double-sided and mixed technology PCBs up to 300x500mm, with an option for 460x700mm boards, the system features laser-controlled wave height compensation, high-precision jet-fluxing and CAD data import.