Component Management

The engineers at optical instrument makers Gooch & Housego use a high specification UV cure adhesive in a military application. It is premixed with microspheres to ensure bondline thickness. However, there were problems in getting a homogenous dispersion of microspheres in the mix - which could lead to poor fitment of the optical element and subsequent removal, cleaning and re-working.

  Ewan Ramsay, Principal Engineer, Raytheon UK, explains why SiC (Silicon Carbide) holds the key to high power semiconductor technology and how it can help push electronics further into harsh environments.

  The designers and manufacturers of the Soundbeam that created an award-winning 'touch free' device, which uses sensor technology to translate body movement into music and sound, turned to Newbury Electronics when they need PCBs for their product.

Morgan Advanced Materials’ Specialty Graphite business is helping customers within the semiconductor industry to operate in challenging environments with its Glassy Carbon Impregnation and Glassy Carbon Coating for custom-machined pure graphite products. Both options significantly reduce contaminants that can be shed by graphite parts.

ULVAC has announced a low temperature PZT sputtering technology in mass production scale, enabling next-gen MEMS devices integrated on CMOS. Today, sensors such as accelerometers, gyros and pressure sensors are widely used inside smart phones, tablets and vehicles, enabled by the piezoelectric MEMS device using thin film PZT (lead zirconate titanate, Pb(Zr,Ti)O3).

Helping industry unlock graphene’s potential, 2-DTech has made advances in the fabrication of graphene products using Chemical Vapour Deposition (CVD) techniques. Thanks to its CVD chambers and associated hardware, along with its team of experienced technical staff, the company is now able to deliver high-quality polycrystalline graphene films.

SMP Sintermetalle Prometheus has expanded its portfolio of inductive components with the development and design of magnetically coupled components. SMP will present this development at PCIM 2015 in Nuremberg, Germany, 19th to 21st May 2015.

Cambridge Nanotherm has published results of a round of testing of several thermal PCB materials intended for use in LEDs, including its Nanoceramic thermal management substrates. The tests were conducted by The LIA Laboratories and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

Allowing for higher capacitance values in existing case sizes, the UX dielectric material has been introduced by DLI. Space qualified to MIL-PRF-38534 Class K, the 50V rated dielectric complements the existing 25V rated material. The material can be specified for use with the company’s standard thin film architectures, including Di-Caps, Border Caps, Bar Caps and Gap Caps.

Fujipoly has announced an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound which exhibits a low thermal resistance. Sarcon SG-26SL delivers a thermal conductivity of 2.6W/m°K when dispensed between a component such as a CPU or power converter and a heat sink.