Component Management

Molex's EON compliant pin technology provides a better alternative to wave soldering processes in power and signal PCB assembly for automotive electrical and electronic systems. The EON compliant solutions support OEM and Tier 1 automotive suppliers in meeting stringent manufacturing requirements and environmental initiatives.

The water-based cleaning medium VIGON RC 303 from Zestron, has been specifically developed for manual removal of persistent residues in reflow ovens and wave solder machines. It reliably removes condensed fluxes and emissions from assemblies of oven devices, solder frames and condensation traps.

Aqueous Technologies CEO, Michael Konrad, presented Low Standoffs, High Densities and High Reflow Technologies. The Challenges of Modern Day Cleaning, during the recent SMTA Intermountain Expo at Boise State University. 

Researchers at Tokyo Institute of Technology and the Japan Science and Technology Agency have designed a liquid crystal molecule that produces high-performance organic field effect transistors with good temperature resilience and relatively low device variability, in addition to high mobility.

An automated solution, which speeds up the precision assembly of performance-critical components for smart devices, has been released by JOT Automation. When using the JOT V4 Assembly Cell, there’s no need to buy features not needed in production at the time. The customer can choose the modules needed according to their requirements, allowing machine functionality to be easily fine-tuned for future assembly and volume needs.

RS Components has introduced the WXR 3 range of all-in-one rework stations, the latest additions to Weller’s WX family of products. Compatible with all of Weller’s WX ‘intelligent’ tools, the WXR 3 is a 600W 3-channel rework offering exceptional performance and a number of new innovative features including traceability and bench top control. These stations are very competitively priced and are in stock ready for rapid desp...

Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15μm. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressive heat transfer capabilities and thermal conductivity of 2.88-3.60W/m·K, suitable for applications in the aerospace, optoelectronic and speciality OEM industries.

  Designed for the bonding of dissimilar materials with differing rates of thermal expansion to provide a tough and resilient joint, the adhere IRS 2129 rubber modified adhesive has been released by Intertronics.

Since scientists first reported carbon nanotubes in the early 1990s, these tiny cylinders have been part of the quest to reduce the size of devices and components. Carbon nanotubes, or CNTs, are 100 times stronger than steel and a sixth of the weight. They have several times the electrical and thermal conductivity of copper, and almost none of the environmental or physical degradation issues common to most metals, such as thermal contraction and ...

The process of trial and error in scientific research is costly and time-consuming. And while scientific innovation and discovery is necessary to find solutions to some of society’s largest challenges - think clean energy, national security, more accessible technologies - the development of more efficient materials typically takes decades and millions of dollars.