Component Management

Engineered Materials Systems has introduced the EMS 561-147-2, a low-cost snap cure conductive adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. The adhesive is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Smartphone manufacturer, Xiaomi Technology, has selected the Stanyl ForTii polyamide from DSM for use in the frame splitters of the Xiaomi Mi4. Smartphones with a metal frame design are in high demand, however, this design makes the transmission and receipt of antenna signals particularly challenging. Insulative antenna splitters address this challenge. 

Aqueous Technologies, announces that it has released a Cleaning and Contamination Guide. The guide was written by Aqueous’ CEO Michael Konrad and is available for download free of charge at www.aqueoustech.com/cleaning-book-1.

Morgan Advanced Materials has launched of a range of piezoelectric materials that deliver reliable sensing and monitoring in environments above 200ºC. Based on the proven properties of lead zirconate titanate (PZT), the materials are suitable for both vibration and pressure sensing in applications such as process & plant control, power generation, automotive and aerospace.

KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place 21st May, 2015. Dr. Mike Bixenman will present the paper titled How Clean is Clean Enough?

The latest stencil cleaning products will be showcased at the SMTA Carolinas Expo & Tech Forum, scheduled to take place on the 19th May 2015. KYZEN’s stencil cleaning products have been designed from the ground up to meet the tough challenges of cleaning no-clean, lead-free residue from small, 01005 apertures while being compatible with modern nano-coatings as well as with all the modern offline cleaning equipment currently used in the ...

A database for designers specifying copper alloys for demanding applications has been introduced by the Copper Development Association. The Copper Alloys Knowledge Base, which is free to use, is a joint project from the European Copper Institute and AGH University of Science and Technology in Krakow.

Isola has expanded its portfolio of halogen-free laminates and prepregs for high-end mobile applications with IS350MD, which slots into the range between Isola’s well-established standard Dielectric constant (Dk) material, DE156, and the company’s ultralow Dk material, IS300MD, which was introduced in 2014 and quickly gained momentum in the High Density Interconnect (HDI) market.

With options to significantly reduce contaminants that can be shed by graphite parts, Morgan Advanced Materials’ Specialty Graphite business, wants to help its customers within the semiconductor industry to operate in challenging environments with its Glassy Carbon Impregnation and Glassy Carbon Coating for custom-machined pure graphite products.

ASSCON will use its space, booth 339, hall 7, at SMT Hybrid Packaging, 5th to 7th May 2015, Nurnberg, to present its Dynamic Profiling Plus automatic temperature profiling and active control system, an extension of the previous Dynamic Profiling system, which ensures process safety in serial operation.