Component Management

Europlasma has used Computex 2015 to present its growing family of innovative nanocoating solutions to waterproof electronic devices under the Nanofics brand name. Nanofics refers to nanoscaled functionalisation into the core of complex shaped materials and products. It is Europlasma’s patented and patent pending nanocoating technology platform, first applied on an industrial scale in 1996.

Laser shapes in a variety of types, including circle, oval, square, ring, oval ring and twin, have been released by Japan Unix. A beam-splitting technology provides a twin-spot laser, which enables the simultaneous soldering of two joints.

  The introduction of the EMS 618-15 adhesive has been annouced by Engineered Materials Systems. The room temperature cure, two-part, conductive adhesive has been designed for circuit assembly applications.

With an enhanced range of programmable functionality, the Fisnar DC100 is an advance in fluid dispensing technology which allows the user more control over their dispensing applications. Alarms can be set to notify the user when material life has ended or fluctuations in dispensing pressure have occurred.

Nordson ASYMTEK has announced the sale of two Spectrum II S2-922 in-line dispensing systems to GN ReSound, one of the world's largest manufacturers of hearing healthcare solutions. GN ReSound presently has an installed base of off-line Nordson ASYMTEK coating systems and Axiom X-1000 dispensers. The Spectrum II systems are being used as part of automated manufacturing production lines to apply underfill in the manufacture of hearing aids.

Royal DSM has announced that its high-performance polyamides, Stanyl and Stanyl ForTii, have been approved by global producers for use in next-gen USB Type-C connectors. DSM’s materials answer the need for improved levels of safety and reliability. The company highlighted its various solutions for mobile devices at Chinaplas 2015, which took place from 20th to 23rd May in Guangzhou.

At the recent IEEE IITC conference in Grenoble, France, nanoelectronics research center imec and Tokyo Electron Limited jointly presented a direct copper etch scheme for patterning Cu interconnects. The scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.

During the IEEE IITC conference in Grenoble, nanoelectronics research centre imec and Lam Research jointly presented a bottom-up prefill technique for vias and contacts. The technique, based on ElectroLess Deposition (ELD) of cobalt, is a highly selective method resulting in void-free filling of via and contact holes. Potentially increasing the circuit performance, it is a promising path to scaling advanced interconnects and enabling future logic...

An electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 1.30-1.44 W/(m·K) has been introduced by Master Bond. As a polysulfide based system, the EP21TPFL-1AO has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. This unusual blend of properties makes the system suitable for a variety of bonding, sealing, coating and encapsulation applications in the elec...

Altium Limited has announced an open beta programme for their community-driven PCB design tool. CircuitMaker will be available worldwide to all interested electronics designers and aims to address the unique needs of the electronics maker and hobbyist community with a free software offering. Anyone interested in participating in the open beta can register now at the CircuitMaker website, with invitations being sent out from week of 18th May, 2015...