Boards/Backplanes
Subrack chassis and modules are MicroTCA.1 compliant
VadaTech has announced MicroTCA.1 compliant chassis and modules for air-cooled rugged applications. Utilising an enhanced retention screw to hold the modules in place for rugged environments, the MicroTCA.1 specification defines a maximum operating shock of 25g and random vibration of 8g.
Motherboard copes with indoor and outdoor usage
ASRock’s SBC-210 is a 3.5in SBC industrial single motherboard offering a low cost, high end and reliable solution. It is suitable for digital signage, POS systems, kiosks, panel PCs and the automation market and is now available at Display Solutions. The board supports the latest Intel Atom Baytrail-M/D Processor meeting the most recent operating systems requirements.
Mini-ITX motherboards offer improved graphic performance
A series of mini-ITX motherboards, offering OEMs a choice of three AMD 2nd gen SoC processors, has been introduced by WIN Enterprises. The MB-73360 series of motherboards feature CPUs that are integrated with GPUs based on AMD's Graphics Core Next technology, highlighting the series' graphic performance.
3U VPX system aims to speed up application development
A pre-configured 3U VPX system, designed to speed up the application development of 3U VPX software radio and data acquisition I/O boards, has been released by Pentek. Aimed at the company's Flexor FMC, Cobalt Virtex-6 and Onyx Virtex-7 FPGAs, the Model 8267 extends the existing SPARK development systems.
Wi-Fi development boards cover wide range of applications
Mouser Electronics is now stocking the new SimpleLink Wi‑Fi CC3100 and CC3200 Processor development boards from Texas Instruments (TI). Marketed as an Internet-on-a-chip low-power Wi‑Fi family, these Wi‑Fi development boards allow users to develop with the CC3100 network processor and CC3200 Wi‑Fi MCU families to easily add embedded Wi‑Fi and Internet connectivity to a wide-range of applications.
Surveillance board provides improved I/O configurations
To meet the demand for high-quality and reliable surveillance, DFI have introduced the HD631-Q87 board. Powered by the 4th generation Intel Core processor, the board provides rich 2D/3D graphics. By integrating Intel HD Graphics, the ATX embedded board supports high-resolution DVI-I and HDMI displays.
Development platform eases path to Internet of Things
Texas Instruments CC3200 Launchpad and CC3100 BoosterPack, a development platform and Wi-Fi device, created for faster and easier implementation of solutions for the Internet of Things(IoT) is now available at Farnell element14. The kit is the industry’s first single-chip programmable microcontroller with built-in Wi-Fi connectivity suitable for applications in cloud connectivity, home automation, safety and security, health and fitness, an...
Mini-ITX motherboards provide rich I/O connectivity
Three Mini-ITX embedded motherboards which offer improvements in processing performance, system memory and I/O interfaces, has been released by DFI. The HM100-HM86, HM101-HM86 and HM103-HM86, powered by the 4th generation Intel Core processor family, are designed with two 204-pin DDR3L SODIMM sockets supporting up to 16GB.
Development board targets USB applications
A new development board featuring a Freescale Kinetis K next-generation microcontroller and crystal-less USB controller is now available from Farnell element14. The Freescale Freedom FRDM-K22F is targeted at USB applications that require a high level of integration and the lower-power capabilities of the new generation of ARM Cortex-M4 core; @120MHz with Floating Point Unit and embeds 512KB Flash and 128KB RAM in a LQFP64 package.
Dev kit combines FRAM and ULP system architecture
Farnell element14 has launched the Texas Instruments MSP430 ULP(ultra low power) FRAM LaunchPad, a development platform which combines embedded FRAM (Ferroelectric Random Access Memory) and a holistic ultra low-power system architecture.The MSP-EXP430FR5969 is an easy-to-use Evaluation Module for the MSP4305969 microcontroller, and enables developers to reduce energy budgets, minimise product size and enable a battery-free world.