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Artificial Intelligence
13th November 2014
Toshiba Launches New Line-up of Image Recognition Processors

Toshiba Electronics Europe has expanded its line-up of image recognition processors with the launch of the TMPV760 series. Supported by 14 hardware-based image recognition accelerators, the first device in this new series will support the implementation of next generation Advanced Driver Assistance Systems (ADASs). 

Micros
10th November 2014
Slimline application processor suits wearables

  With the launch of the TZ1021MBG application processor, Toshiba has expanded its ApPLite family. Applications for the device include activity monitors, smart watches, smart-wristbands and smart-glasses, as well as other wearable products.

Power
4th November 2014
MOSFET delivers lower RDS(ON) at higher temperatures

Based on the company's high voltage DTMOS IV super junction technology, Toshiba Electronics Europe announces an 800V power MOSFET. The TK17A80W is suitable for equipment that requires high reliability, power efficiency and a compact design, such as power supplies and adapters, fly back converters and LED lighting equipment.

Power
30th October 2014
Dual-sided cooling improves MOSFET heat dissipation

Toshiba Electronics Europe has revealed that its high-efficiency, low-voltage MOSFETs are now available in ultra-compact DSOP Advance package options, which offer dual-sided cooling to improve heat dissipation by more than 30%. This enables designers to minimise the PCB temperature and improve performance without board space penalties in high-component-density applications.

Optoelectronics
29th October 2014
Transistor output photocoupler offers high isolation

  Suitable for applications including inverter interfaces and general-purpose power supplies, a transistor output photocoupler has been introduced by Toshiba Electronics Europe. The TLP385 offers a high isolation performance, guaranteeing a minimum isolation voltage of 5kVrms.

Communications
23rd October 2014
Infotainment companion chip supports 4K multimedia

Supporting hi-res multimedia connectivity and camera devices with ethernet AVB standard, Toshiba has introduced the TC358791XBG automotive companion chip. The AEC-Q100 Grade 3 qualified chip, features differential CVBS interfaces for analogue composite video sources, support for early back-up camera view (CVBS to LVDS) and the ability to relay packetised IQ audio tuner data to the host via USB.

Optoelectronics
14th October 2014
Photocouplers directly drive IGBTs & power MOSFETs

Suitable for applications such as home appliances, inverters, factory automation and control equipment, Toshiba Electronics Europe has introduced two photocouplers. The TLP5701 provides a peak output current of ±0.6A which makes it suited for low-power IGBTs and power MOSFETs, while the TLP5702's ±2.5A peak output current makes it suitable for driving medium-power devices.

Power
8th October 2014
Quietly operate home & office automation equipment

Enabling compact design and quiet operation in applications such as home appliances and office automation equipment, Toshiba Electronics Europe has introduced four motor driver ICs. The TB67S269FTG bipolar stepping motor driver provides 50V and 2A for printers, office automation equipment, ATMs, amusement machines and home appliances.

Memory
3rd October 2014
World’s smallest-class embedded NAND Flash memory

Toshiba Electronics Europe has launched what it claims to be the world’s smallest-class of embedded NAND flash memory products integrating NAND chips fabricated with cutting-edge 15nm process technology. The e-MMC NAND chips are designed for applications including smartphones, tablets and wearable devices.

Design
30th September 2014
Starter kits ease the development of BLE subsystems

Comprised of a Bluetooth Low Energy (BLE) IC, MCU, sensors and associated software, Toshiba Electronics Europe has announced a starter kit. The TC35667FTG BLE IC integrates a highly efficient DC/DC converter in a low-power circuit design, reducing peak current consumption to less than 6mA and deep sleep current consumption to less than 100nA.

Analysis
26th September 2014
Web simulator simplifies part selection & system design

Helping engineers analyse the performance of components for the power stages of embedded designs, Toshiba Electronics Europe has launched the 'Toshiba Semiconductor Web Simulator'. This online design tool also helps to improve overall system effectiveness and efficiency.

Optoelectronics
16th September 2014
Image sensor enables cameras with a z-height of 6mm or less

Targeting high-end mobile handsets and smartphones with 1080p resolution, Toshiba Electronics Europe introduces a 1.12μm CMOS image sensor with an optical height of 1/2.4". The T4KA7 sensor enables engineers to develop camera modules with a z-height of 6mm or less for ultrathin and ultralight mobile devices.

Optoelectronics
11th September 2014
LEDs simplify general & industrial lighting designs

Toshiba Electronics Europe has expanded its LETERAS family of white LEDs, introducing the TL1L3 series. The 1.0W LEDs combine cost-effective gallium nitride-on-silicon (GaN-on-Si) chips with an industrial standard 3535 lens type package with a footprint of 3.5x3.5mm and a height, including lens, of just 2.42mm.

Optoelectronics
28th August 2014
Photovoltaic couplers increase isolation voltage to 3750Vrms

Designed for use in measuring instruments, as MOSFET gate drivers or the replacement of mechanical relays, Toshiba Electronics Europe has announced the TLP3905 and TLP3906 photovoltaic couplers. The devices expand application possibilities by increasing the maximum operating temperature to 125°C and increasing the minimum isolation voltage to 3750Vrms.

Micros
27th August 2014
MCU improves efficiency & reduces development costs

Expanding Toshiba Electronics Europe's TX00 series of ARM Cortex-M0 core-based microcontrollers, the TMPM037FWUG has been announced. Featuring a low pin count of just 64 pins in a 10x10mm LQFP with 0.5mm pin pitch, the MCU is designed for motor control applications in equipment such as multifunction printers, printers, consumer electronics, digital equipment and factory automation equipment.

Micros
18th August 2014
MCU facilitates energy calculation for smart meters

Expanding the company's TX04 series of ARM Cortex-M4F microcontrollers, Toshiba Electronics Europe has announced the TMPM411F20XBG. This MCU facilitates secure electric power calculation and communication in smart meters, as well as sensing and communications in other measurement applications.

Design
7th August 2014
Storage and the connected car

Automotive storage always used to refer to how much boot space a car had, or whether there was a sizeable glove box and sunglasses holder. Today, automotive storage is also used to refer to the amount of digital storage space a car contains – and as more and more of our work and entertainment are delivered digitally, the importance of digital storage increases. By Boris Hafner, Senior Manager, Automotive Sales, Toshiba Electronics Europe.

Communications
6th August 2014
HDD is designed specifically for surveillance applications

The MD04ABA-V series, a HDD designed specifically for surveillance applications, has been introduced by Toshiba Electronics Europe's (TEE). Designed for use in RAID/multi-HDD based surveillance platforms such as SDVR, SNVR and hybrid SDVR, the device series supports up to 32 HD cameras and can operate continuously.    

Design
4th August 2014
Starter kits speed time-to-market for IoT devices

Providing various drivers for rich Internet applications using HTML5, Toshiba's BTZ5000-2MA-A1 and RBTZ5000-6MA-A1 starter kits speed the development of web applications using the Toshiba TZ5000 Application Processor Lite (ApP Lite) series. The kits enable users to easily introduce embedded development environments and speed time-to-market for IoT, streaming media and other content-rich consumer devices.

Power
21st July 2014
A hybrid approach to inverter efficiency and performance improvement

Silicon carbide (SiC) devices have the potential to unlock significant performance and efficiency improvements in applications ranging from rail traction to renewable energy generation. This paper describes how the introduction of hybrid technologies that combine these performance and efficiency advantages with the high-power handling capabilities of silicon injection-enhanced gate transistors (IEGTs) is providing engineers with an effective way ...

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