Can Flash with built-in error correction support the latest Flash technology without more complex 4-bit or 8-bit ECC? By Eugen Pfumfel, Principal Engineer, Memory Marketing, Toshiba Electronics Europe.

Expanding its ARM Cortex-M4F based TX04 series, Toshiba Electronics Europe has introduced two MCUs which can operate two BLDC motors simultaneously. The TMPM470FDFG and TMPM475FDFG incorporate two modules, each containing a programmable motor drive, 12-bit ADC and vector engine, ensuring efficient and simultaneous operation.

Designed to enhance noise tolerance and negate interference from in-car mobile phone use, a 45W per channel power amplifier IC has been introduced by Toshiba Electronics Europe. The four-channel TCB001HQ provides increased reliability with a newly developed filter circuit and reinforced protection circuits, including thermal overvoltage, output to VCC, output to GND and output to output protection.

Toshiba Electronics Europe has announced that it will exhibit at the Wearable Technologies Conference 2015, 2nd and 3rd February in Munich. The company will present ultra-small solutions for wearable applications including sensors and application processors, wireless charging, Bluetooth comms, fast data transfer using TransferJet, memory and LED devices.

NEC has now begun the commercial production phase of its iPASOLINK microwave communication equipment for mobile networks, which utilises Toshiba’s FFSA (Fit Fast Structured Array) custom LSI solution. Toshiba’s solution, which employs licensed technology from BaySand, meets NEC's performance, power and time-to-market requirements. 

At Embedded World 2015, which takes place from 24th to 26th February, Toshiba Electronics Europe will be showcasing technologies from across its wide range of standard and custom semiconductor solutions. Various application processors from the company’s ApPLite range will be demonstrated at the show. These application processors support secure communication and provide timely processing of text, sound, image and sensor data.

  The TC7PCI3212MT and TC7PCI3215MT SPDT switch ICs, which support transmission of a signal speed up to PCIe Generation 3 (8Gb/s), have been released by Toshiba Electronics Europe. 

Designed to optimise power management functions, Toshiba Electronics Europe introduces a system PMIC for mobile products such as smartphones, tablets, handheld medical devices, industrial PDAs, barcode readers and portable instruments. The TC7734FTG integrates power path, switching charger, four buck converters, three LDO regulators and two LED backlight drivers.

Designed as 10W wireless power solutions for smartphones, tablets and mobile accessories using the Qi Standard Low Power Specifications version 1.1, the TC7765WBG wireless power receiver IC and TB6865AFG transmitter IC have been released by Toshiba Electronics Europe.

Equipped with the company's 19nm 2nd gen NAND flash memory, Toshiba Electronics Europe has announced a series of Solid State Hybrid Drives (SSHDs). The MQ02ABD100H provides a 1TB capacity in a 9.5mm high form factor, while the MQ02ABF050H offers a capacity of 500GB in a drive 9.5mm high.

The MG04ACA and MG04SCA 6TB SATA and SAS models have been released by Toshiba Electronics Europe, expanding its MG04 series of 3.52" HDDs. For seamless integration with latest-gen data centre infrastructure, the SAS interface HDD provides 12Gbit/s transfer rates and enhanced power management features. The MG04 series is specifically designed for midline and nearline business critical workloads. 

Comprised of a photo MOSFET optically coupled with an infrared LED, Toshiba Electronics Europe has introduced four ultra-small photorelays. The TLP3475 and TLP3440 have been designed to deal with high frequency signals; while the TLP3417 and TLP3420 are suitable for dealing with the high voltages required for signals of measured devices such as semiconductor testers.

Toshiba has announced the launch of three application processors, the latest additions to its ApP Lite family's ARM Cortex-A9-based TZ2000 series. The TZ2100 group devices are high performance application processors, which support enhanced sound and image data-mining, communications and security functions.

Expanding its TX04 series of MCUs, Toshiba Electronics Europe has announced the ARM Cortex–M4F core-based TMPM440F10XBG. The device is suited for applications including precision equipment, portable devices and security cameras with motion sensors, single-lens reflex cameras and amusement machines.

Toshiba announces two eSSDs, the HK3E2 for value-endurance workloads and the HK3R2 drive for read intensive workloads. These 6Gb/s SATA Enterprise SSDs join Toshiba’s broad portfolio of enterprise storage solutions featuring a variety of endurance ratings to meet the needs of specific application requirements and customer environments.

Supporting BLE communications and NFC Type 3 Tag functions, Toshiba Electronics Europe has launched a low power consumption, dual-function IC. The TC35670FTG is suitable for use in Bluetooth Smart devices including wearable healthcare devices, touch-and-start smartphone accessories, sensors and toys.

As consumers start demanding more connected cars, multiple wireless networks including Bluetooth and WiFi must coexist within the vehicle. Semiconductor integration holds the key to ensuring interoperability within tight cost, size and power constraints. By Heiner Tendyck, Principal Engineer for Solution Marketing and Strategic Business Planning, Toshiba Electronics Europe.

  Integrating an N-channel IEGT (Injection-Enhanced Gate Transistor) and an SiC fast recovery diode, the MG1500FXF1US71 high-efficiency 3300V, 1500A power module has been introduced by Toshiba Electronics Europe.

Designed to protect equipment attached to communication lines, an ESD protection diode has been introduced by Toshiba Electronics Europe. The DF5G7M2N protects high-speed interfaces such as USB3.1, HDMI, DisplayPort and Thunderbolt from static electricity, as well as shielding small portable devices such as smartphones and tablets from ESD events.

Toshiba Electronics Europe (TEE) has launched the industry's first VESA’s embedded Display Port (eDP)-to-MIPI dual-DSI converter chipset. The new TC358860XBG chipset enables 4K2K ultra high definition (UHD) experiences on handheld electronic devices such as tablets, phablets and portable gaming systems.