The Molex Brad Ultra-Lock system is designed to bring the ease of a push-pull connector to IP67/IP68/IP69K rated sealed connections in industrial environments. The M12-compatible Brad Ultra-Lock technology provides a seal that surpasses the performance and reliability of traditional threaded connectors.

    Molex will present interconnect solutions, as part of its platform for industrial automation, to help customers address Industry 4.0 applications at Hannover Messe 2017 (Hall 9, Stand F76).

    Molex will focus on next gen cabin network systems at the Aircraft Interiors Expo to be held at 4th to 6th April in Hamburg, Germany.

Molex has introduced its µPDB custom sealed modules which are suitable for customers looking to add or relocate power switching and circuit protection in vehicles. Fully customised to customers’ needs, the modules utilise only the specific components and materials needed for the application.

  Molex has announced a strategic collaboration and investment in Excelfore. Headquartered in Fremont, CA with offices in China, Germany, India and Japan, Excelfore specialises in middleware solutions for smart mobility networks that support next-generation smart, autonomous and learning vehicles, fleets and associated infrastructure.

Molex has released the Impact zX2 Backplane Connector System, featuring industry-leading density and signal integrity (SI) performance, while supporting data rates of up to 28 Gbps in a modular design. The system utilises Impel patented ground shielding and footprint technology to enhance SI performance. Customers looking to upgrade their line cards to meet ever-increasing data rate requirements can now do so without making major revisi...

Combining QSFP+, Impel or near-ASIC (Application Specific Integrated Circuit) connectors with thin twinax cables, Molex has introduced its BiPass I/O and Backplane Cable Assemblies. The BiPass I/O and Backplane Assemblies provide a low-insertion-loss alternative to PCB traces capable of meeting 112Gbps PAM-4 (pulse-amplitude modulation) protocol.

In order to provide cost-effective, reliable sealed performance, Molex has introduced the ValuSeal Wire-to-Wire connector system. The IP65-rated, integrated wire-and-ring seal system is capable of 11A power, suitable for consumer, non-automotive transportation and lighting applications. 

  The Impulse Orthogonal Direct Backplane Connector System has been introduced by Molex. It is designed for high-density data centre applications and also supports data rates of 56Gbps NRZ and 112Gbps PAM4 with superior signal integrity.

Molex has introduced Nano-Fit Power Connectors, which provide terminal protection with what the company claims to be the smallest fully isolated terminal power connector in the market. In addition, keying options ensure proper mating and a Terminal Position Assurance (TPA) feature virtually eliminates terminal backout.

A Dual Source Alliance (DSA) agreement has been announced between Molex and TE Connectivity (TE) to produce a new generation of high-speed Input/Output (I/O) and backplane connectors, and cable assemblies for data communications applications.

A range of Glow-Wire compliant RAST 2.5 Wire-to-Wire Headers has been introduced by Molex. These connectors deliver power and cost efficiency through an interface that can be terminated and cross-mated with any existing RAST infrastructure. Available in panel mount and flying header versions, the connectors are suitable for power and signal applications carrying up to 4.0A (32V).

A hermaphroditic CyClone Panel-to-Panel Connector System has been introduced by Molex, designed for secure high-mating cycle connections. The CyClone connector modules offer 10,000 mating cycles for extreme durability in telecommunications, networking, consumer and industrial electronics.

  The Brad DeviceNet HarshIO M8 Modules have been introduced by Molex, which it claims to be the first on the market to come fully ODVA conformance tested and approved. 

Molex has introduced what it calls Solder on Polyester Substrate, a flexible alternative to rigid PCB and polyimide. Surface Mount components, including fine-pitched ICs are attached with low-temperature solder and encapsulated on a polyester substrate. According to the company, custom designed products can be used for capacitive touch buttons, capacitive fluid level sensors and membrane switches in a broad range of consumer, medical and ind...

  A Dual Source Alliance (DSA) agreement has been announced between Molex and TE Connectivity (TE) to each produce a new generation of high-speed Input/Output (I/O) and backplane connectors, and cable assemblies for data communications applications.

In order to strengthen its portfolio of printed electronics solutions, Molex has signed a worldwide license agreement to manufacture Enfucell SoftBattery power sources. The non-exclusive partnership allows Molex to better serve rapidly growing markets for wearable and Internet of Things (IoT) electronics products and sensor applications powered by printable batteries.

  The industry’s first ODVA conformance tested and approved IP67 EtherNet/IP I/O module to interface with roller drives has been introduced by Molex. 

Molex has announced the launch of PowerLife standard and custom wireless power coils with NuCurrent technology for plug-free device charging. The integrated wireless power coils feature an industry-leading thin design and the highest power transfer efficiency (Q-factor) of any wireless charging solution on the market today. Molex PowerLife wireless power coils with NuCurrent technology support low, high and proprietary frequencies, in standa...

A distribution agreement has been signed by Molex for their industrial product range with Bürklin Elektronik for Europe. More than 34,500 items from the Molex Industrial segment can now be ordered via Bürklin Elektronik. This will include product line brand names like Woodhead, mPm DIN Valve Connectors, GWconnect Heavy Duty Connectors, Flamar Cables and Brad Automation.