Molex introduces its MediSpec High-Density Micro-Ribbon Cables which replace individual primary wires and flexible circuits with ribbonized parallel wires bonded together using fluoropolymer technology into an organized, dense package for ease-of-routing and electrical length matching. Developed at the Molex Temp-Flex facility, the innovative technology, which will be showcased at MD&M West, February 12-14, Anaheim Convention Center, CA, Molex bo...

Molex continues to tap into world-class interconnect expertise to develop solutions for next-generation healthcare devices. Molex, along with subsidiaries Affinity Medical Technologies LLC, Temp-Flex LLC and Polymicro Technologies, will showcase a multitude of products that enable medical device manufacturers to deliver more robust capabilities in increasingly smaller design footprints. These interconnect products will be on display at MD&M West,...

Molex announces the PDJack connector, its next-generation PoE Plus single-port integrated controller Power Device jack. Integrating all necessary Power Device controller circuitry and Ethernet connectivity, the Molex PDJack connector is a complete off-the-shelf PoE Plus Power Device solution.

Molex Incorporated recently expanded support to data and telecommunications networking customers with the addition of Quick-Turn Line (QTL) Cable Assemblies, providing rapid order processing and shipping on custom length optical cable assemblies. The QTL assemblies will shorten lead times for customers requiring small to medium sized orders of Molex optical cable assemblies.

Molex introduces its SpeedStack Mezzanine Connector System, a high-density, low-profile solution that supports data rates of up to 40 Gbps per differential pair. The system is ideal for OEMs that contend with limited PCB real estate in a variety of industries including telecommunications, networking, military, medical electronics and consumer technology.

Molex Incorporated introduces high density iPass+ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths. Available in multiple configurations (1-by-1, 1-by-2, 1-by-4), versatile press-fit iPass+ zHD connectors accommodate a range of high density data and networking application...

Molex introduces the Brad M12 Power Connector System to meet the demand for higher power consumption requirements of control, sensing and actuators in automation control systems while maintaining a small compact footprint. Submitted for IEC and ANSI/EIA acceptance, Molex aims to establish an open-industry connector standard to increase adoption among a wide array of platforms and manufacturers.

Molex has launched a German-language version of its website, providing customers in German speaking countries such as Germany, Austria and Switzerland with access to valuable product information, news and technical resources. It also allows users to search for and order parts in German, which simplifies the process and reduces errors due to translation issues.

Ideal for OEM light-fixture manufacturers, Molex LED Array Holders simplify the installation process for next-generation, energy-efficient Citizen CLL010 through CLL050 arrays and reduce installation time with compression contacts that eliminate hand soldering.

Molex introduces a new firmware release of the SST Ethernet communication module. The firmware update supports the Siemens Industrial Ethernet protocol to connect ControlLogix PLCs to Siemens SIMATIC controllers (S5, S7-1200, S7-200, S7-300 and S7-400), SIMOTION motion controllers, RFID and barcode readers, SINAMICS variable frequency drives and SINUMERIK CNC systems.

Molex will announce its new EXTreme EnergetiC High-Current Connector System at DesignCon 2013, January 29-30 at the Santa Clara Convention Center in Santa Clara, CA, Molex booth 109. The new connector system is designed to provide high-end datacom OEMs and power supply manufacturers with an advanced solution for applications requiring high current up to 100.0A per bay. It joins an extensive family of Molex EXTreme interconnect and power supply pr...

Molex introduces the SST IP67 PB3 Remote Module for PROFIBUS. A linking device with on-board PROFIBUS and Ethernet communication ports, the SST IP67 PB3 remote module provides a fast and easy solution for adding PROFIBUS Master and Slave connectivity to Rockwell Logix controllers (CompactLogix, ControlLogix, SoftLogix†, etc).

Molex have today announced the introduction of new Brad Direct-Link unmanaged switches available in 5- and 8-port modules, both featuring patented Ultra-Lock push-pull technology. The new IP67 sealed Direct-Link switch modules provide a fast, simple and secure on-machine Ethernet switch solution reducing network cabling and installation costs.

Molex introduces new products from subsidiary Temp-Flex. Designed for high-bandwidth applications using proprietary processes, Temp-Flex microwave cables deliver exceptional electrical performance in military, aerospace and defence, robotics and medical markets, in addition to automatic test equipment.

Molex introduces the company’s MediSpec Micro-Miniature Coiling capability designed for medical applications, including minimally invasive surgery, catheters and implanted devices. Constructed of biocompatible materials, MediSpec MMC features a continuous length coil enabling extrusion of micro gauge (50 to 26 AWG class) wire at virtually infinite lengths.

Molex announces availability of its QSFP+ low power 56Gbps Fourteen Data Rate Active Optical Cable, which delivers a reliable and less costly solution for aggregated data rates up to 56 Gbps over reaches up to 4km. The QSFP+ 56Gb AOC integrated cable requires less than 1W per cable and provides the flexibility of traditional optical modules by interfacing to systems via a standard MSA QSFP connector.

Molex Incorporated has augmented its CPU solutions with the launch of an Intel-approved LGA 2011-0 CPU socket for the Intel Core i7 series of 32nm-Sandy Bridge-E microprocessors. Designed to handle 130W Thermal Design Power (TDP), the LGA 2011-0 socket replaces the LGA 1366 CPU socket, which was used with the Intel Core i7-930, i7-950, i7-960, i7-980 and i7-990X processors.

Molex Incorporated announces the introduction of its next-generation HSAutoLink II Interconnect System. Delivering on the automotive industry’s need for multiple high-speed media protocols, the HSAutoLink II Interconnect System meets all these demands in one system. Typical applications include in-vehicle infotainment, telematic devices, radio and navigation systems, as well as meeting the rising demand for advance drive assist cameras used...

Molex and profichip announce a strategic cooperation focusing on PROFINET technologies. Molex software development kits are the first choice of many PLC manufacturers and device makers for PROFINET connectivity where maximum throughput and efficiency are key requirements. The Molex offer includes PROFINET IO-Controller and IO-Device SDK based on ANSI “C” source code.

Molex has expanded its micro-SIM card socket portfolio for mobile device manufacturers. Designed for smart phones, tablet PCs, GPS watches and other space-constrained applications, micro-SIM push-push card sockets deliver high contact and advanced card-retention features to prevent accidental ejection. The push-pull socket versions offer anti-shorting and card polarization features. A new card-tray version provides retention assurance and ease of...