Molex have announced the launch of a new portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in telecommunication, networking and storage systems, advanced computing platforms, industrial controls and medical equipment.

Molex Incorporated announced today its Projected Capacitive Touch Screens, which leverage existing Molex capacitive switch technology to deliver multi-touch functionality that is responsive and intuitive to operate. The touch screens allow original equipment manufacturers (OEMs) to meet specific customer needs by providing customised embedded software; multiple screen and glass styles; a variety of treatment finishes and various output interface ...

Molex has introduced Brad Direct-Link unmanaged switches available in 5- and 8-port modules, both featuring patented Ultra-Lock push-pull technology. The new IP67 sealed Direct-Link switch modules provide a fast, simple and secure on-machine Ethernet switch solution reducing network cabling and installation costs.

Molex Incorporated introduces modular, stackable HS Stac headers that combine the high-speed USCAR-30 HSAutolink interface with the modular, stackable configuration of the versatile Stac64 connector system. With a 0.80mm pitch, the new HS Stac headers achieve greater design-flexibility and space-savings in PCB trace-routing for in-vehicle infotainment and telematic devices.

Molex extends its offering of Brad mPm external thread, field attachable DIN valve connectors with the introduction of DIN Form B, C and Micro versions with electronic circuitry. Options include a bi-polar Light Emitting Diode power on indicator, LED with blocking diodes to protect against over voltage or peaks when switching off, and bi-polar LED with a voltage-dependent resistor to protect supply and switch.

Molex introduces its MediSpec High-Density Micro-Ribbon Cables, which replace individual primary wires and flexible circuits with ribbonised parallel wires bonded together using fluoropolymer technology into an organised, dense package for ease-of-routing and electrical length matching.

Temp-Flex LLC introduces its MediSpec micro extrusion primary wires. Designed to meet tight tolerance requirements for invasive and implantable medical applications, Temp-Flex MediSpec micro extrusion primary wires deliver optimal reliability down to 52 AWG in a wide range of biocompatible conductor materials.

Molex Incorporated announces a new development in LED array holder technology with integral electrical, mechanical and optical connectivity for optimal performance and to simplify design integration for lighting manufacturers.

Molex Incorporated introduces the MX150 unsealed connector system for direct connect or in-line mid-power body electronics applications in the automotive industry, where space is limited, such as interior lighting, consoles, vanity mirrors, seats and door locks. Using the field-proven Molex MX150 terminal design, which is currently deployed at numerous harness manufacturers, the new unsealed connection system achieves significant space savings ov...

Molex Incorporated has ramped up its engineering and production investment for custom LED circuit assemblies that can operate reliably in extreme conditions and harsh environments such as those found in military and aerospace applications.

Molex Incorporated has introduced the next-generation HSAutoLink II interconnect system for linking multiple high-speed media protocols in automotive electronics. The HSAutoLink II system is designed for in-vehicle infotainment, telematic devices, radio and navigation systems, in addition to intelligent assistant systems and cameras for parking, lane departure, pedestrian warning, night vision, and other collision avoidance vision systems.

Today’s digital-savy drivers are accustomed to 24/7 connectivity to the internet and 24/7 communication with colleagues, employers, family, and social networks. Whether shopping economy or luxury class vehicles, they want the total driving package price, safety, performance, reliability, comfort and the ‘Wow’ factor. Enhanced driver and passenger features can help build automotive brand identity and differentiate a manufacturer’s offering...

Molex has announced high density iPass+ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75mm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.

Molex introduces its SpeedStack Mezzanine Connector System, a high-density, low-profile solution that supports data rates of up to 40 Gbps per differential pair. The system is ideal for OEMs that contend with limited PCB real estate in a variety of industries including telecommunications, networking, military, medical electronics and consumer technology.

Molex Incorporated has received the Flextronics 2012 Mechanical Regional Supplier of the Year award. This significant award recognises Molex for its outstanding contributions and performance in quality, technology, overall service and support. Molex was the exclusive connector supplier receiving this award at the inaugural regional supplier event presented by Flextronics in Shenzhen, China.

Polymicro Technologies, a subsidiary of Molex Incorporated, has successfully developed a broad spectrum optical fibre with a low -OH pure silica core that demonstrates significantly reduced content of UV defects and other UV absorption centres. Polymicro’s proprietary FBPI fibre takes advantage of the benefits and mitigates the limitations of standard optical fibres. Featuring improved transmission properties over a much wider spectral rang...

Molex introduces the EXTreme EnergetiC High-Current Connector System. Complementing Molex’s extensive family of EXTreme interconnect and power supply products the EXTreme EnergetiC High-Current Connector System is designed to provide high-end datacom OEMs and power supply manufacturers with an advanced solution for applications requiring up to 100.0A per bay.

Molex has announced new customised capacitive fluid-level sensors, a low-cost measuring solution with disposable sensors and reusable electronic circuitry. Designed for measuring fluid or granular material in non-metallic containers, the patent pending sensor electrode design and configurable software provide higher accuracy with lower hardware cost and easier installation.

Temp-Flex, a Molex subsidiary, will showcase its MediSpec micro extrusion primary wires at the Molex booth 1983 at MD&M West, February 12-14, Anaheim Convention Center, CA. Designed to meet tight tolerance requirements for invasive and implantable applications in the medical industry, Temp-Flex MediSpec micro extrusion primary wires deliver optimal reliability down to 52 AWG in a wide range of biocompatible conductor materials.

Molex Incorporated has augmented its CPU solutions with the launch of an Intel-approved LGA 2011-0 CPU socket for the Intel Core i7 series of 32nm-Sandy Bridge-E microprocessors. Designed to handle 130W Thermal Design Power (TDP†), the LGA 2011-0 socket replaces the LGA 1366 CPU socket, which was used with the Intel Core i7-930, i7-950, i7-960, i7-980 and i7-990X processors.