Infineon and Wolfspeed have announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018.

Infineon and GlobalFoundries (GF) have announced a new multi-year agreement on the supply of Infineon’s AURIX TC3x 40 nanometre automotive microcontrollers as well as power management and connectivity solutions. The additional capacity will contribute to secure Infineon’s business growth from 2024 through 2030.

Infineon has launched the next-gen EZ-PD PAG2, a secondary-side controlled ZVS flyback converter chipset.

Infineon Technologies combines its expertise in magnetic position sensors with its linearised tunnel magnetoresistance (TMR) technology to launch the XENSIV TLI5590-A6W magnetic position sensor.

Infineon has announced its partnership with OMRON, combining Infineon’s GaN-based power solutions with circuit topology and control technology of OMRON.

Infineon has announced the launch of its new magnetic position sensor, the XENSIV TLI5590-A6W. This sensor, featuring a wafer-level package, is designed for both linear and angular incremental position detection. 

Infineon Technologies is ensuring it will not run short of 150-millimetre silicon carbide (SiC) wafers.

Infineon Technologies AG and Aurora Labs announced their collaboration to enhance predictive maintenance solutions in the automotive industry. 

Infineon Technologies AG has announced its commitment to set a science-based target. By that Infineon expands its climate strategy even further.

Infineon has launched the TDA388xx family, targeting the server, AI, datacom, telecom, and storage markets.

The growing power demand in data centres and computing applications necessitates advancements in power efficiency and compact power supply design.

Infineon Technologies has introduced the latest addition to the EZ-USB family: The FX10 peripheral controller.

Türkiye’s next gen electronic passports with contactless Coil on Module solution from Infineon Technologies.

At TRUSTECH, the tradeshow for innovative payment and identification solutions, Infineon will present the latest member of the TEGRION family, which accelerates future-proof ID applications. Infineon’s mini airport booth will also feature the world’s first PQC-enabled ePassport demonstrator. In addition, visitors can experience the convenience of seamless payment with SECORA Pay X, which will be demonstrated in a pop-up manicure salon...

At the conclusion of the PROGRESSUS research project 22 project partners presented the project's results in Bari, Italy.

Infineon has offered valuable perspectives on the electric vehicle thermal management systems market in its latest webinar.

Infineon has expanded its 650V CoolMOS CFD7A portfolio by introducing the QDPAK package to address the accelerated transition to electric vehicles has led to significant innovations in charging systems that demand more cost-efficient and high performing power electronics.

Infineon announced the expansion of its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package.

Infineon has announced the PSoC 4000T family of microcontrollers (MCUs) a low power usage MCU for multi-sense applications.