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Infineon Technologies AG

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

Displaying 901 - 920 of 975
Automotive
2nd April 2012
Infineon’s 650V CoolMOS CFDA for Automotive Applications

Infineon Technologies expands its Automotive power semiconductor lineup with the new 650V CoolMOS CFDA. This is the industry’s first Superjunction MOSFET solution with Integrated Fast Body Diode to meet the highest Automotive qualification standard AEC-Q101. The 650V CoolMOS CFDA is particularly designed for resonant topologies such as battery charging, DC/DC converters and HID (High Intensity Discharge) Lighting, also in hybrid and electric ve...

Optoelectronics
7th March 2012
Infineon Enhances Online Design Tool for LED Lighting, Adding Additional Features and Support for LED Driver ICs Used in General Lighting Applications

Infineon Technologies enhanced its online design solution Infineon Light Desk, adding additional features and the support for a new series of AC/DC off-line LED drivers.

Automotive
26th January 2012
Infineon Introduces Innovative New H-PSOF Packaging for Automotive Power Electronics; Sets New Standard for High-Current Capability and High Efficiency

Infineon Technologies today introduced an innovative package technology providing high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles. The new TO package is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead). The first available products using the H-PSOF package technology are 40V OptiMOS T2 power transistors offering up to 300A current ...

Automotive
6th December 2011
Infineon Introduces Automotive Qualified 100 Percent Lead-free Power MOSFETs in Standard TO Package Types

Infineon Technologies AG today introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Based on the combination of innovative packaging technology and Infineon’s thin wafer process technology, the new 40V OptiMOS T2 power MOSFETs offer best-in-class specifications. Infineon uses a diffusion soldering die attach approach to produce the lead-free packages that include TO-220, TO-262 and TO-263. Because of specifi...

Automotive
22nd November 2011
Infineon AUDO MAX SHE Enhances In-Vehicle Security and Tamper-Proofs Electronic Control Units

Infineon Technologies AG now offers 32-bit microcontrollers of the AUDO MAX family with integrated security hardware. The new AUDO MAX SHE microcontrollers extend the tamper-proofing of electronic control units (ECU) and protect against tuning, for example. AUDO MAX SHE enables automotive manufacturers to ensure the integrity of their ECUs and to guard better against exposure to liability claims. Today three products of the AUDO MAX family come w...

Analysis
1st November 2011
Bombardier Transportation and Infineon Enter into Strategic Partnership in the Field of Drive Electronics for Locomotives, High-Speed and Metro Trains

Infineon Technologies AG and Bombardier Transportation have entered into a strategic partnership in the field of drive electronics for advanced rail vehicles. The agreement envisages the supply of semiconductor components by Infineon to Bombardier in the course of the coming five years. These power semiconductors enable energy-efficient control of electric motors in locomotives, high-speed trains, underground and urban railways. Infineon will ens...

Design
1st November 2011
Infineon Introduces Microcontroller Multicore Architecture for Automotive Applications

Infineon Technologies AG today introduced its 32-bit microcontroller (MCU) multicore architecture. The new architecture is the foundation of Infineon’s next generation MCU family that will fulfill the requirements of upcoming automotive powertrain and safety applications. The multicore architecture features up to three processor cores to share the application load, introduces lockstep cores and contains further enhanced hardware safety mechanis...

Power
28th September 2011
Hyundai Selects Infineon HybridPACK1 Power Module for Its Current Hybrid Vehicle Generations

Infineon Technologies AG today announced that Hyundai Motor Company and Kia Motors Corporation have selected Infineon as supplier of power modules for their current hybrid car generations, the Hyundai Sonata Hybrid and Kia Optima. Hyundai and Kia, together the world’s fastest-growing and fifth-largest car manufacturer, teamed up with Infineon on the hybrid powertrain design including the Infineon HybridPACK™1 power module and the related cont...

Power
7th September 2011
New Infineon Automotive Power Management 40V P-Channel OptiMOS P2 Chips Improve Energy Efficiency and Save Costs with EPS, Motor Control and Electric Pumps

Infineon Technologies AG introduced its latest family of single P-channel 40V automotive power MOSFETs produced using advanced trench technology. The new 40V OptiMOS P2 products strengthen Infineon’s leadership in power management for next-generation automotive applications by setting new benchmarks in improved energy efficiency, reduced CO2 emissions and cost savings.

Analysis
15th August 2011
RELY Research Project: New Ways of Chip Design Methodology

Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical tec...

Analysis
10th August 2011
European e-BRAINS Research Project Lays the Foundations for the Integration of Heterogeneous Systems Using 3D and Nanotechnology

September 2010 saw the launch of the European e-BRAINS (Best-Reliable Ambient Intelligent Nano Sensor Systems) research project in which Infineon Technologies AG is joining forces with 19 partners to conduct research into the integration of heterogeneous systems. Led by Infineon and Fraunhofer EMFT (Fraunhofer Research Institution for Modular Solid State Technologies), for the technical management, the project will run until the end of 2013. Nano...

Automotive
10th August 2011
Infineon Extends its XC2000 Automotive Microcontroller Family: New Low-End Devices Enable Body, Safety and Powertrain Solutions with 32-Bit Performance at 8-Bit Costs

Giving the medium-sized and compact car category access to the safety and convenience applications of the premium segment and enabling their compliance with the strictest fuel consumption and pollutant emission requirements, Infineon Technologies AG today announced the cost-optimized extension of its successful XC2000 automotive microcontroller portfolio. Enabling 32-bit equivalent performance at 8-bit costs the new 16-bit devices address low-end...

Sensors
10th August 2011
HONEY Lays the Cornerstone for Highly Complex Driver Assistance Systems in Medium-Sized Vehicles; HONEY Research Project Successfully Concluded

Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...

Design
10th August 2011
RELY Research Project: New Ways of Chip Design Methodology

Germany’s foreign trade success is determined to an ever-increasing degree by the quality and reliability of high-tech products. Seven partners from the German business and research communities are teaming up in the three-year “RELY” project to explore ways of enhancing the quality, reliability and resilience of modern microelectronic systems. The focus will be on applications in transportation, in particular electromobility, in medical tec...

Wireless
4th August 2011
World’s Smallest Integrated Receive Front-End Modules BGM103xN7 Series from Infineon for GPS and GLONASS Applications Now Available

Infineon Technologies has introduced a new series of Receive Front-End Modules for implementation of Global Navigation Satellite System (GNSS) functionality in Smart Phones and other handheld devices. The new BGM103xN7 Series devices are the first modules available that support separate or simultaneous reception of both Global Positioning System (GPS) and Globalnaya Navigatsionnaya Sputnikovaya Sistema (GLONASS) signals.

Design
7th July 2011
Infineon Extends its XC2000 Automotive Microcontroller Family: New Low-End Devices Enable Body, Safety and Powertrain Solutions with 32-Bit Performance at 8-Bit Costs

Giving the medium-sized and compact car category access to the safety and convenience applications of the premium segment and enabling their compliance with the strictest fuel consumption and pollutant emission requirements, Infineon Technologies AG today announced the cost-optimized extension of its successful XC2000 automotive microcontroller portfolio. Enabling 32-bit equivalent performance at 8-bit costs the new 16-bit devices address low-end...

Design
7th July 2011
HONEY Lays the Cornerstone for Highly Complex Driver Assistance Systems in Medium-Sized Vehicles; HONEY Research Project Successfully Concluded

Even today, a medium-sized vehicle contains about 1,000 chips and as many as 80 networked electronic systems. These numbers are set to grow as state-of-the-art safety technology gains traction – for example, driver assistance systems that help to prevent hazards such as rear-end collision in fog. The tight design envelope of a car means that existing systems have to become ever smaller and new ones have to be as compact as possible. This is whe...

Power
23rd May 2011
Infineon - EconoPACK + D Family IGBT Modules for Highest Demands Posed by Wind and Solar Systems and Industrial Drives

Infineon Technologies presents the EconoPACK + D family, the latest generation of power semiconductor modules in the 1200V and 1700V voltage classes with up to 450A nominal current, at the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany. Infineon has developed the new EconoPACK™ + D series based on the well-known and established EconoPACK™+ platform to master the ever-growing demands in applications such as renewable energies, commercial v...

Power
23rd May 2011
Infineon - New RC-Drives Fast IGBTs Enable Up To 96% Energy Efficiency with High Switching Frequency While Reducing the Inverter Size and Cost

At PCIM Europe (May 17-19) in Nuremberg, Germany, Infineon expanded its family of Reverse Conducting (RC) 600V IGBT with two new switching power devices that achieve up to 96% efficiency in target applications. The new RC-Drives Fast devices allow design of energy efficient, electric-motor driven consumer appliances that use smaller components and thus have a lower overall cost compared to alternative systems.

Power
23rd May 2011
Infineon`s 650V CoolMOS CFD2 Technology with Integrated Fast Body Diode Said to Take Energy Efficiency in Applications like Servers, Solar, Telecom SMPS and Lighting to the Next Level

With its latest generation of high-voltage CoolMOS MOSFETs Infineon is rolling out another innovation setting new standards in the field of energy efficiency. At the PCIM Europe 2011 (May 17-19) in Nuremberg, Germany, Infineon presents the new 650V CoolMOS™ CFD2 – the world`s first high-voltage transistor with both a drain-source voltage of 650V and an integrated fast body diode. The new CFD2 devices succeed the 600V CFD products, enabling no...

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