To address the growing Dual-SIM (Subscriber Identity Module) market Infineon Technologies today launched its new XMM2138 platform, supporting Dual-SIM operation. Dual-SIM mobile phones enable simultaneous use of two SIMs in the handset, with features like call hold and swap to provide real-time switching facility between both SIMs at the touch of a button. Today there is a high growth rate for Dual-SIM phones in the BRIC (Brazil, Russia, India, a...

Infineon Technologies announced XMM6181, a new entry-level smartphone platform for Android handsets addressing the high volume consumer segment. XMM 6181 offers open OS support for Android through a highly integrated system solution that will help to bring mobile social networking to the mass market. With this extension to its smart devices portfolio, Infineon brings smartphone functionality for a new price segment with wholesale prices between ...

Infineon Technologies announced XMM6181, a new entry-level smartphone platform for Android handsets addressing the high volume consumer segment. XMM 6181 offers open OS support for Android through a highly integrated system solution that will help to bring mobile social networking to the mass market. With this extension to its smart devices portfolio, Infineon brings smartphone functionality for a new price segment with wholesale prices between ...

Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...

Infineon Technologies announced the availability of XMM™6260, the latest platform in its 3G slim-modem family. The XMM 6260 platform is optimized as a slim-modem for smart phone architectures coupled with an application processor or as a standalone solution for PC modems and data cards. This advanced HSPA+ platform is based on two new highly integrated Infineon devices: the X-GOLD™626 baseband processor and the SMARTi™UE2 Radio Frequency (R...

Smart card manufacturers Giesecke & Devrient GmbH (G&D) and Oberthur Technologies S.A., and chip suppliers Infineon Technologies AG and INSIDE Contactless S.A. today announced they have launched an industry initiative to provide a new security solution for next-generation smart card-based public transport applications. The solution will build on an open standard now being implemented by the four partner companies, which will eventually be govern...

Infineon Technologies today expanded the application scope of its OptiMOS power MOSFET portfolio, introducing a family of 200V and 250V devices well-suited for synchronous rectification in 48V systems, DC-DC converters, uninterruptable power supplies (UPS) and inverters for DC motor drives. Featuring the lowest Figure of Merit (FOM) compared to alternative devices, OptiMOS 200V and 250V technology slash conduction losses in system designs by one...

Infineon Technologies AG today raised the guidance for the first quarter of the 2009/10 fiscal year. For the first quarter of the 2009/10 fiscal year Infineon now expects high single digit growth in group revenues compared to the fourth quarter of the 2008/09 fiscal year and high single digit margin for the Combined Segment Result. This increase is mainly driven by the Automotive (ATV) and Industrial & Multimarket (IMM) segments.

A research project to strengthen German competiveness by developing processes and verification methods for more flexible and secure automated manufacturing has been launched by leading German companies. The SANITAS (”Enabling safer systems by a new collaborative verification methodology across the entire value chain”) project includes nine partners – research institutes and companies from the semiconductor, automotive and industrial automat...

Infineon Technologies AG and Nokia today announced a cooperation to develop advanced radio frequency transceiver solutions. The agreement covers a non-exclusive collaboration to ensure the compatibility and interworking of Nokia’s advanced licensable baseband modem technologies and Infineon’s leading RF solutions.

Infineon Technologies is extending its portfolio of energy efficient lighting ICs with a new family of low cost linear LED drivers. The new BCR320 and BCR420 product families address the burgeoning market for energy-saving and environmentally friendly light-emitting diode (LED) lighting solutions. Specifically designed for driving 0.5W LEDs with a typical current of 150mA to 200mA, these LED drivers feature a negative thermal coefficient contrib...

Infineon Technologies today announced it is the world’s first semiconductor provider of TPM (Trusted Platform Module) security chips that successfully passed most stringent security tests currently defined for PC security. The Trusted Computing Group (TCG), an impartial not-for-profit organization, confirmed that Infineon’s TPM is “TCG Certified”. The TCG certification is based on the international security standard “Common Criteria”...

The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.