In the future, mobile devices will be able to quickly and realistically detect their surroundings in 3D. When they do, it will be thanks to the 3D image sensor chips from Infineon Technologies and pmdtechnologies. REAL3 will enable extremely realistic virtual and augmented reality game experiences that involve the interaction of the gamer’s own hands and his living environment within the game via head-mounted devices.

Infineon Technologies expands its µHVIC family of integrated circuits for high and low voltage: the single channel low-side drivers IR44252L, IR44272L and IR44273L enable robust and cost effective design solutions. The device family utilises Infineon’s proven, robust high voltage junction isolation (HVJI) technology to realise multiple functions and integrate robust protection features.

Further advancing the development of Functional Safety industrial applications Infineon Technologies has announced the availability of the Safety Package for the XMC4000 family of 32-bit MCUs. The XMC4000 Safety Package helps to develop TÜV-certified automation systems that conform with Safety Integrity Levels SIL2 and SIL3.

The 2EDN7524 EiceDRIVER ICs from Infineon Technologies have been launched for the PFC, LLC and synchronous rectification stages of switch mode power supplies. Enhancing the existing EiceDRIVER family, the 2EDN family is the link between control ICs and MOSFET, e.g. CoolMOS C7, as well as GaN switching devices. The 2EDN MOSFET driver IC enables high system level efficiencies, power density and consistent system robustness.

Infineon Technologies increases performance and security of contactless payment transactions. The SLC 32P family of security controllers speeds up data handling by the factor of 15. It enables manufacturers of payment cards, wearables and proximity devices such as tokens to meet requirements mandated by MasterCard from January 2016 onwards.

Infineon Technologies provides the embedded Secure Element (eSE) chip for all Samsung Gear S2 models. The chip safeguards users’ sensitive data and supports secured contactless payment transactions based on NFC technology. The Gear S2 comes with a unique rotating bezel and works with a variety of phones running Android 4.4 or later. The 3G version adds stand-alone functions and built-in GPS using its own 3G cellular connection.

Infineon Technologies has announced that it supplies the embedded Secure Element (eSE) chip for the latest Lenovo smartphones. Besides the Lenovo Vibe P1 introduced at the IFA 2015, Infineon’s security controllers are also used in the Lenovo Vibe X3. These security chips offer protection of security-critical functionalities of the mobile device.

Further enhancing IGBT performance, Infineon Technologies has announced the S5 (S for soft) family based on the ultra-thin wafer TRENCHSTOP 5 IGBT. This family has been developed specifically for AC/DC energy conversion in industrial applications switching up to 40kHz, typically to be found in PV inverters or UPS.

Barcelona is Spain’s second largest urban area and according to Juniper Research one of the smartest cities in 2015. The “T-Mobilitat” electronic fare collection system will further improve urban mobility. Infineon supplies the security chips for the “T-Mobilitat” infrastructure - for both the chip-based tickets, that work contactlessly, as well as validators based on the advanced security standard CIPURSE.

Infineon Technologies Austria AG has opened a building complex in Villach for production, research and development. The expansion will be driven forward through 2017 by investments and research expenditure totaling €290m. The focus is on designing the development and production environment according to the principles of Industry 4.0.

Infineon Technologies has announced a leap forward in bringing security to the IoT. The company has launched the Infineon Security Partner Network (ISPN) to make proven semiconductor-based security easily accessible to the growing number of manufacturers of connected devices and systems. The ISPN connects IoT security players with outstanding expertise in specific applications and markets.

Certified security solutions from Infineon Technologies AG enable protection of data, devices and networks in both mainstream computing and the emerging IoT. The company has announced that its OPTIGA TPM (Trusted Platform Module), based on the latest TPM 2.0 standard, is the first such device to comply with internationally recognised computer security requirements.

Every fifth kWh of electricity around the world is used for artificial light. LED technology is making significant savings possible. About 13m tons of CO2 could be saved in Germany alone, equaling the emissions of about 7m cars, and office electricity bills could be reduced by more than €500m. But how can introducing the technology be made easier for industry and end users?

The high-frequency radar chip team at Infineon has been nominated for the Deutscher Zukunftspreis 2015 (German Future Award), the German President's Award for Innovation in Science and Technology. Radar systems in cars make a major contribution to improving road safety, measuring distance and speed in relation to other vehicles in order to give drivers early warning and trigger braking in emergencies.

Throughout Europe 25,700 people were killed on the roads last year – an average of 70 traffic fatalities a day. Most of these accidents happened because the motorists weren’t paying attention. A system has been designed to assist the driver and significantly reduce the number of accidents. At the 2015 International Motor Show (IAA), Kostal presents a camera-based ADAS with know-how from Infineon.

Infineon Technologies has announced that it is the world market leader in power semiconductors for the twelfth consecutive time. After acquiring International Rectifier at the beginning of the year, Infineon's 19.2% market share now makes it the clear market leader. In comparison, both companies’ market share in 2013 summed up to approximately 17.5%, according to the results of a 2014 study by the US market research institute IHS.

Infineon Technologies has introduced the first devices in a family of Gallium Nitride on Silicon Carbide (GaN-on-SiC) RF power transistors at this year's European Microwave Week. As part of Infineon’s GaN portfolio, the devices allow manufacturers of mobile base stations to build smaller, more powerful and more flexible transmitters.

DIY tools such as cordless drills and saws have to be handy and durable. Therefore, the electronic components used in the applications need to be space-saving and rugged. Infineon has extended its StrongIRFET Power MOSFET family, providing a solution that fulfills both requirements. The Logic Level StrongIRFETs can be driven directly from a MCU, saving space and cutting costs.

The German Federal Minister for Economic Affairs and Energy Sigmar Gabriel recently visited Infineon Technologies Dresden GmbH. He was accompanied by Martin Dulig, the Saxon State Minister for Economic Affairs, Labour and Transport, and Iris Gleicke, Parliamentary State Secretary and German Federal Government Commissioner for the New Federal States.

Infineon has announced that it has shipped its ten millionth high-frequency radar chip. The 77GHz chips are used in radar-based driver assistance systems that recognise objects at ranges of up to 250m. Infineon estimates that in the year 2014 nearly 50% of 77GHz radar systems in vehicles were equipped with Infineon technology.