The research project SemI40 (“Power Semiconductor and Electronics Manufacturing 4.0”) led by Infineon Austria was launched recently. In this project 37 partners from five countries will carry out research into further developing autonomous factories. The common goal is the next stage in the development of  Industry 4.0 applications. With a volume of €62m, the research project is one of the largest Industry 4.0 projects in Eu...

Unveiled at the annual Imec Technology Forum in Brussels (ITF Brussels 2016), imec and Infineon Technologies are cooperating in CMOS sensor chip development. The two companies are working on highly integrated CMOS-based 79GHz sensor chips for automotive radar applications with imec's contribution of its advanced expertise in high-frequency system, circuit and antenna design for radar applications complementing Infineon’s radar sensor chip k...

For the first time, two prototypes of products controlled exclusively through gestures were demonstrated at Google I/O: a smartwatch and a wireless speaker. Both devices can recognise gestures that replace switches or buttons with this revolutionary concept, which was enabled by technology from Infineon Technologies and Google ATAP.

Infineon Technologies has launched what it claims to be one of the most important European pilot line projects for sensors and sensor systems at its Dresden site. The project name, IoSense, is derived from the “Internet of Sensors”. The IoT will require vast quantities of sensors in order to succeed. Cost-effective production of sensor systems is, therefore, a key prerequisite as they enable devices and systems to capture and process ...

Expanding its CoolMOS family, Infineon Technologies has introduced the CoolMOS C7 Gold 650V in a TO-Leadless package. This combination of improved superjunction semiconductor process and advanced SMD package design is delivering unparallelled performance in hard switching applications. The small footprint of this package brings power density advantages for server, telecomms and solar applications.

Power modules from Infineon for hybrid and electric vehicles (H/EVs) meet challenges presented by CO2 regulations to meet targets of 95g CO2 /km in Europe, 121g/km in the US, 117g/km in China and 105g/km in Japan by 2020. The HybridPack Double Sided Cooling (DSC) power modules for H/EVs measure 42 x 42.4 x 4.77mm.

Infineon Technologies and Würth Elektronik present an easy and affordable entry into digital power control applications. The Digital Power Explorer Kit was developed for analogue power supply designers and embedded software programmers to help them better understand and implement the capabilities of digital power control based on standard MCUs.

Maximising the performance characteristics of SiC, Infineon has announced it is sampling 1,200V SiC MOSFETS. The CoolSiC MOSFETs are available in three- and four- pin package options and improve dynamic loses, especially at high currents.

  Infineon has added a number of wide body package options to its EiceDRIVER Compact galvanically isolated gate driver IC family. The 7.62mm (0.3") 1EDI Compact devices are supplied in a DSO-8 package offering increased creepage distances and improved thermal behaviour.

Offering a scalable design platform for 3-phase motor drives in the 20 to 300W range, Infineon announces its iMotion Modular Application Design Kit (MADK). The compact and flexible evaluation system includes controller and power boards (optionally with sensors). Using the kit, a full functioning motor system will be running in less than one hour, enabling a faster time-to-market.

Infineon Technologies announces SiC MOSFET technology which allows product designs to achieve previously unattainable levels of power density and performance. Infineon’s CoolSiC MOSFETs offer a new degree of flexibility for increasing efficiency and frequency. They will help developers of power conversion schemes to save space and weight, reduce cooling requirements, improve reliability and lower system costs.

Infineon Technologies has introduced a discrete 600V TRENCHSTOP Performance IGBT which provides high energy efficiency and reliability at a competitive price point for applications such as air conditioning, PV inverters, drives and UPS. Based on Infineon’s TRENCHSTOP technology, the IGBT is optimised for hard switching topologies working at frequencies of up to 30kHz.

Infineon Technologies has introduced the TO-220 FullPAK Wide Creepage package, offered for the 600V CoolMOS CE MOSFETs which target a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.

Infineon's LED lighting interface IC allows designers to replace many of the discrete components used in conventional dimming schemes with a single device. Therefore, the compact and highly integrated CDM10V can reduce the component count and PCB space needed for dimming circuitry in LED lighting applications by up to 70%.

95% of the universe is still considered unexplored. Scientists at CERN, the world’s largest particle physics research centre, are working on solving these mysteries. In May 2012, researchers there discovered the so-called Higgs Boson, whose prediction won Peter Higgs and François Englert the Nobel prize in physics.

Radar systems in trucks and construction vehicles play an important role in increasing the safety of road transport. Because they monitor blind spots, alert drivers if they come too close to other road users and automatically initiate the braking process in case of emergency. Radar systems make it safe to drive in columns with short following distances.

The SOT-223 package allows for a 10% cost reduction, in comparison to DPAK, writes Rene Mente, Infineon Technologies. The SOT-223 is a direct pin-to-pin replacement for DPAK designs with slightly reduced thermal behaviour in comparison to DPAK.

Infineon Technologies will be equipping the lastest Lenovo ThinkPad ntoebooks with OPTIGA TPM (Trusted Platform Module) chips. The PC manufacturer thus responds to an increase of networking and associated security risks. In recent years, Lenovo has sold more than 100m notebooks from the successful ThinkPad family.

A new integrated power stage family from Infineon Technologies features a power efficiency rating reaching 96%. This means the power stage devices can be combined with Infineon’s generation digital PWM power management controllers. This provides a full multi-phase voltage regulation (VR) system solution for server, storage client and communications systems.

Infineon Technologies, in collaboration with Beijing-based Mobile Payment Solutions, has released a unique, plug-and-play NFC security module series which significantly reduces design efforts for device manufacturers by bundling a high-end Infineon security chip with NFC antenna components and software on a small PCB footprint. The smallest module of the series measures just 4x4mm.