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Infineon Technologies AG

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

Displaying 561 - 580 of 927
Sensors
10th January 2018
Sensor chip lets you unlock your phone with your face

  Everyone seems to be talking about unlocking smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies the unlock-with-your-face feature becomes smarter, faster and more reliable.

Wireless
3rd January 2018
Fuelling the future at CES 2018

Efficient and easy to use wireless charging for smartphones, wearables, medical and industrial devices possible with the AURIX and XMC microcontroller families. Infineon Technologies offers flexible chip sets for high performance including software IP for smart and safe wireless charging applications. Working with a systems solution partner, Infineon provides reference designs for both inductive and resonant wireless char...

Communications
22nd December 2017
Creating better data security for vehicle communications

The more connectivity and automated driving functions are built into cars, the more important embedded IT security becomes for vehicle communication. Infineon Technologies and ESCRYPT work closely together in the field of automobile cyber security. Both companies are now offering a solution that encrypts on-board communication and makes it more secure while considering future security requirements.

Cyber Security
11th December 2017
Infineon receives two awards for contactless security chip

Infineon Technologies has been recognised with two SESAMES Awards for the world's first post-quantum cryptography implementation on a contactless security chip. 

Communications
6th December 2017
Coil on Module security chips for contactless ID documents

Within the core of electronic ID cards (eID) and passports you can find powerful and robust security solutions. Security chips in 'Coil-on- Module' (CoM) packages offer significant advantages here. Infineon Technologies AG is now expanding its CoM portfolio with a complete solution for contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate monoblock inlay (Inlam).

Power
23rd November 2017
MOSFET pushes performance boundary to the next level

  Infineon Technologies' latest high voltage Superjunction MOSFET technology has been released. The 600V CoolMOS CFD7 completes the CoolMOS 7 series. This new MOSFET addresses the high power SMPS market for resonant topologies. It offers efficiency and reliability in soft switching topologies like LLC and ZVS PSFB.

Power
6th November 2017
Five output digital voltage regulator is for multi-rail systems

  Available in a QFN package, the IRPS5401 is Infineon Technologies' five output point of load (PoL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems.

Cyber Security
19th October 2017
WiFi Krack vulnerability shows any wireless tech could be at risk

Following the recent news on the WiFi Krack vulnerability, Richard Edgar, Director of Communications, Imagination Technologies, said: “With 71% of mobile comms flowing over wireless internet, WiFi is now the most significant communications platform around the world. Therefore, when a story like KRACK breaks it is easy to understand why it makes the headlines – the vulnerability could affect millions of people. However, ...

Artificial Intelligence
10th October 2017
Microcontroller family brings autonomous driving a step closer

  The AURIX microcontroller family from Infineon Technologies helps realise automated driving by using a critical safety compute element and vehicle interface for the NVIDIA DRIVE PX 2 AI car computing platform. 

Design
9th October 2017
High SNR MEMS microphones complement Amazon AVS dev kit

On 5th October 2017, XMOS launched its VocalFusion 4-Mic Dev Kit for Amazon Alexa Voice Service (AVS) for far-field applications. The kit integrates Infineon’s high SNR microphones to ensure highest performance and reliability. XMOS now offers the first Amazon AVS development kit with a linear mic array for far-field applications. The 4-Mic Development Kit features crystal clear voice capturing even in noisy environments. This enables comma...

Power
6th October 2017
The quest for improved power conversion efficiency

  The search for improved power conversion efficiency and reduction of energy losses is always on. In co-operation with Infineon Technologies, Eltek engineers have cracked the code again, reducing losses by 50% while further improving reliability and total cost of ownership.

Displays
15th September 2017
Investment in voice-controlled human machine interfaces

In just three years from now, we can expect that 30 billion devices will belong to the Internet of Things (IoT). Cars, homes, industrial plants and consumer devices are rapidly becoming connected to the Internet. While today the interaction between humans and machines is mostly done by touch, the next evolutionary step of IoT will lead to the omni-presence of high-performance voice control. Infineon Technologies wants to further develop its capab...

Power
24th August 2017
Power MOSFET designed for low power SMPS market

  Infineon Technologies is expanding its recently launched CoolMOS P7 superjunction power MOSFET family with a SOT-223 package. The device has been developed as a one-to-one drop-in replacement for DPAK.

Micros
28th July 2017
Packaged MEMS microphones offer 70dB signal-to-noise ratio

Addressing the needs for high performance, low noise MEMS microphones, Infineon Technologies is entering the packaged silicon microphone market. The analogue and digital microphones are based on Infineon’s dual backplate MEMS technology and feature a 70dB signal-to-noise ratio (SNR). This is combined with a low distortion level of ten percent at a 135dB sound pressure level (SPL). In a 4x3x1.2mm MEMS package, the microphones are suited...

Power
19th July 2017
IGBT modules offer increased current rating of 150A

With the introduction of the EconoPIM 3 package, Infineon Technologies has expanded its product portfolio of IGBT modules. The current rating of the module is thereby increased from 100A by 50% to 150A. The new power modules serve the growing demand for higher power density within the same footprint. Typical applications are motor controls for drives in elevators, escalators, fans or pumps.

Sensors
26th June 2017
Kit simplifies speed measuring sensor designs

Development kits for sensors from Infineon are significantly reducing design effort – and thereby development time and system costs. For reliable and fast measurement of speed, Infineon Technologies has announced the new Hall sensor TLE4922 as well as the 'Speed Sensor 2Go' design kit that goes with it. The TLE4922 was developed for industrial and automotive applications, where fast and reliable measurement of speed is critical, such as spe...

Test & Measurement
23rd June 2017
Smart power switches offer improved efficiency & miniaturisation

Car makers want in-vehicle electronic systems to provide a large number of energy-efficient functions in as little space as possible. Infineon supports this trend with its new power IC manufacturing technology SMART7. Infineon designed it specifically for automotive applications such as body control modules or power distribution centres. SMART7 power ICs drive, diagnose and protect loads in applications like heating, power distribution, air-...

Analysis
20th June 2017
Infineon awarded "Supplier of the Year" by DENSO

The Japanese automotive system supplier DENSO has honored Infineon with a “Supplier of the Year Award”. DENSO acknowledged the Infineon North America team for their outstanding local support. The award is given to the supplier who demonstrates commitment to exceptional quality and logistics performance. The assessment criteria also include collaboration in advancing automotive technologies and the supplier’s willingness to consi...

Events News
14th June 2017
Preventing cyber attacks in rescue services

Imagine this scenario: a famous football player is involved in a serious traffic accident, just as his team is fighting to avoid relegation. While the player’s accident is not yet publicly known, the IT systems of the hospital are attacked. Looking for sensitive data, the perpetrators come across the name and records of the football player. Nobody yet knows that a substitute for the player will be necessary or that the team’s pos...

Enclosures
7th June 2017
High power density discrete IGBT in TO-247PLUS package

Infineon Technologies has expanded its 1200 V discrete IGBT product portfolio by offering up to 75 A. The devices are co-packed with a full rated diode in a TO-247PLUS package. The new TO-247PLUS 3pin and 4pin packages serve the growing demand for higher power density and highest efficiency in discrete packages. Typical applications with a blocking voltage of 1200 V requiring high power density are drives, photovoltaic, and UPS. Additional applic...

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