Infineon Technologies and Zylia, a Poland-based developer of recording technologies, have enabled the world’s first portable recording studio. The integration of Infineon’s class-leading 69dB SNR digital MEMS microphone into the Zylia ZM-1 microphone array provides a new approach to music recording.

Higher density, low power SMPS designs require high voltage MOSFETs in a growing number. Infineon ushers a new member of its CoolMOS P7 family, the 950V CoolMOS P7 Superjunction MOSFET. It meets even the most rigorous design requirements: for lighting, smart meter, mobile charger, notebook adapter, AUX power supply and industrial SMPS applications. This semiconductor solution delivers thermal and efficiency performan...

Global energy demand is constantly growing. Drivers include electrification in industry, mobility and private consumption, as well as the rising number of consumers. This increases the demand for efficient power semiconductors. These are used wherever electrical power is generated, transmitted or used by the consumer. Devices, machinery and systems are thus managed as efficiently as possible. For 2017, industry analyst IHS Markit, confirms Infine...

Infineon Technologies has enabled a new open source software stack. It makes work easier for developers who want to use the Trusted Platform Module (TPM) 2.0 – a standardised hardware-based security solution for securing industrial, automotive and other applications such as network equipment. This is the first open source TPM middleware that complies with the TSS ESAPI specification of the TCG, providing significant value to the open s...

Infineon Technologies has introduced the next generation TRENCHSTOP IGBT6 technology. With a 650V blocking voltage the discrete device is optimised for specific applications demanding long lifetime, high reliability and efficiency. These are especially major home appliances and small home appliances, industrial sewing machines and general purpose drives which can be found in e.g. fans, pumps and other BLDC motors.

A strategic partnership agreement has been signed between Infineon Technologies and JD group,aimed at creating an efficient and secured smart IoT (Internet of Things) ecosystem accelerating towards the vision of smart life. The two companies will combine Infineon's technology expertise in the semiconductor solution field and the local market insight and network of JD.

A memorandum of understanding (MoU) has been signed by Infineon Technologies and Alibaba Cloud Computing Company (Alibaba Cloud) for the joint promotion of IoT applications within the fields of smart life and smart industry. Infineon and Alibaba will thus facilitate the digital upgrade of Chinese enterprises and cities.

It has been announced that Infineon Technologies is launching a new 1200V IGBT generation TRENCHSTOP IGBT6, an IGBT duopack manufactured on 12" wafer size. The new IGBT technology is designed to fulfil the increasing customer requirements for high efficiency and high power density.

In what is reportedly the fastest time ever measured on a test track, Team WARR Hyperloop of the Technical University of Munich (TUM) reached 290mph with its pod during Elon Musk's third Hyperloop competition. 

Efficient and cost effective controller IC solutions enable optimised LED lighting solutions. Infineon Technologies AG has announced the introduction of the second-gen ICL5102 resonant controller IC designed specifically for power supply and lighting drivers. 

Ten year ago, in 2008, Infineon Technologies AG started the volume production of its first bulk-CMOS radio frequency (RF) switch. Now, in the dawn of the 5G era, Infineon’s well-engineered portfolio and products have received an unprecedented welcome from innovators in wireless markets across the world

Infineon Technologies is launching its first magnetic sensors based on TMR technology. According to the company, this makes Infineon the world’s first sensor manufacturer to offer magnetic sensors based on all four magnetic technologies: HALL, GMR, AMR and TMR. Infineon will present the new XENSIV TLE5501 angle sensor family at the Sensor+Test 2018 fair in Nuremberg (26th-28th June).

Functional safety applications in cars often require substantial system design efforts. With XENSIV TLE5014, Infineon Technologies is now launching a new magnetic angle sensor family that is both ready for these demanding applications and at the same time easy to use. At the Sensor+Test 2018 fair in Nuremberg (26th-28th June), Infineon will demonstrate how easily the new products can be integrated into a safety-critical Electric Power Steering sy...

To date, Infineon Technologies has sold 1.5b security chips with its Integrity Guard technology. Infineon provides robust solutions for enabling the protection of today and tomorrow’s government-issued electronic ID documents like passports from potential security attacks. The technology features a complex digital security architecture. It includes a fully encrypted data path and a self-checking dual CPU core.

The key benefits of gallium nitride (GaN) are, amongst others, high power density, efficiency and decreased system costs. Infineon Technologies have started volume production for CoolGaN products by the end of 2018, the company announced during PCIM Europe. Engineering samples of the high reliable GaN solution in the market are available now. At PCIM 2018 Infineon showcases (Hall 9, booth 412) CoolGaN products in telecom, adapter, wireless c...

Increasing complexity of end products is challenging the design parameters for high power supplies: these require higher power and more efficiency in an even smaller space. Semiconductor devices are essential to the operation and performance of modern switched mode power supplies (SMPS). Over the last years, a trend towards surface mount devices (SMD) has been emerging.

At this year’s PCIM Europe trade fair in Nuremberg, Infineon Technologies AG presents the first products of its automotive Silicon Carbide portfolio: the CoolSiC Schottky diode family is now ready for current and future on-board charger (OBC) applications in hybrid and electric vehicles. Infineon has designed the diodes specifically to meet the high requirements of the automotive industry regarding reliability, quality and performance.

Infineon Technologies has expanded its product portfolio of the thin-wafer technology TRENCHSTOP5 IGBT. The new product family is offering up to 40A 650V IGBT, co-packed with a full rated 40A diode in a surface mounting TO-263-3 also known as D2PAK. The new TRENCHSTOP 5 IGBT in D2PAK package serves the growing demand for higher power density in power devices for automated surface mounted assembly.

  Protecting cars against cyber attacks is becoming increasingly important as more and more electronics are used to steer, accelerate and brake cars. That is why 15 partners from industry and academia will work together over the next three years on new approaches to IT security in self-driving cars.

  Packaging innovation leads to vastly improved cooling and thermal management, says Stefan Preimel, concept and application engineer, Infineon Technologies