Following the EconoDUAL and Easy packages, Infineon Technologies has announced that it offers the TRENCHSTOP IGBT7 technology in a discrete housing. The device comes in a TO-247 with 650V break down voltage. The new TRENCHSTOP family portfolio consists of current ratings of 20, 30, 40, 50, and 75A. It can be used for replacing previous technologies and for paralleling.

By creating a world in which physical objects seamlessly integrate into the information network, transferring data between themselves and the cloud, the IIoT is transforming everything from wind turbines and factory automation to critical infrastructure. However, with this smart, connected world comes an increased and very real threat of cyber attacks. Josef Haid of Infineon Technologies explains.

Infineon Technologies has introduced the XDP controller digital power XDPL8219. The high-performance flyback controller features secondary-side regulation for high-performance and robust LED designs. It provides high power factor and constant voltage output.

In power electronics motor drives take up a major share in the market. With its CoolSiC MOSFET Modular Application Design Kit (MADK) boards Infineon Technologies has helped in further shortening time to market in this relevant segment. As part of the MADK platform for motors of up to 7.5kW, the evaluation board EVAL-M5-IMZ120R-SIC is a 3-phase inverter board aiming at servo drive applications.

Biometric cards with integrated fingerprint sensor make contactless payments more convenient, more secure and hygienic. The contactless card remains in the hands of the cardholder throughout the entire payment transaction, while eliminating the need for PIN entries or signatures to authorise even high-value payments.

Infineon Technologies has introduced a new IGBT power module tailored to the needs of electric vehicle traction inverters in the 80 to 100 kW power class: the HybridPACK DC6i. This six pack module is optimised to deliver an excellent fit of system cost and performance to hybrid and small battery electric vehicles.

On Thursday, NASA Jet Propulsion Laboratory sent the Rover Perseverance on a journey to Mars, with the landing on the Red Planet targeted for February 2021. IR HiRel, an Infineon company, supplied thousands of mission-critical radiation-hardened (rad hard) components for the rover.

Infineon Technologies has announced that it will expand its XENSIV 3D magnetic sensor family TLx493D. At its in-house digital trade show ‘Virtual Sensor Experience’, the chipmaker will present a new device for industrial and consumer applications: the TLI493D-W2BW.

Spain based power conversion group Ingeteam and Infineon Technologies have teamed up for best customer experience in superfast electric vehicle (EV) charging. Rated at 400kW, the converter INGEREV RAPID ST400 from Ingeteam is based on CoolSiC MOSFETs in an EasyDUAL 2B housing. A single charging point implements eight of Infineon’s FF6MR12W2M1_B11 modules.

From power lift gate and sunroof to electric seat adjustment and fuel pumps, an increasingly large number of electric motors ensure safety and comfort in modern cars. Infineon Technologies has presented a new product family called Motor System ICs designed for control of both brushed and brushless DC motors.

Infineon Technologies has announced that its Silicon Valley Innovation Center (SVIC) has entered a new agreement with Blumio to co-develop a wearable, non-invasive blood pressure sensor based on Infineon’s XENSIV radar chipset by 2021.

Silicon carbide in electric vehicles stands for more efficiency, higher power density and performance. Particularly with an 800V battery system and a large battery capacity, silicon carbide leads to a higher efficiency in inverters and thus enables longer ranges or lower battery costs.

Infineon Technologies has added another industry standard package to its CoolSiC MOSFET 1,200V module family. The proven CoolSiC  62mm device has been designed in half-bridge topology and is based on the trench chip technology

Ruggedness determines the longevity and thus the reliability of modules for applications used in harsh environments. In particular the exposure to hydrogen sulfide (H2S) has a critical impact on the lifetime of electronic components. To respond to this threat, Infineon Technologies has developed a protection feature. EconoPACK+ modules with a TRENCHSTOP IGBT4 chipset are the first of the Econo portfolio featuring this new level of protection...

Infineon Technologies has expanded its product offering for battery management systems with a new sensing and balancing IC, the TLE9012AQU. The device is especially designed for batteries in hybrid and electric cars, but it is also suitable for other applications.

Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers. Too often, different thermal coefficients lead to an expansion mismatch of different materials. IR HiRel, an Infineon Technologies company, has solved this issue with fourteen newly QPL-qualified rad hard MOSFETs (radiation-hardened) housed in an innovative direct-to-PCB mounting package.

With SECORA ID, Infineon Technologies offers an easy-to-integrate security platform for contactless digital ID documents. The first product variant, SECORA ID S, is a particularly flexible, Java-based solution. It simplifies and accelerates the design and production of region-specific sovereign documents such as eIDs in card format.

 With the acquisition of Cypress Semiconductor Corporation, Infineon Technologies has enhanced its expertise in memory solutions. Infineon has announced the addition of Semper Secure to its Semper NOR Flash memory platform.

Infineon Technologies releases the BCR431U. The constant current linear LED driver IC provides low-voltage drop performance for regulating LED current. It is the second device released in the new generation BCR family with low voltage drop focusing on low current designs of up to 37mA.

Despite their varied applications, solar inverters, wind turbine converters and ESS solutions have a lot in common. Each typically operates up to the voltage and current extremes of existing silicon switch technology, and each benefits from the efficiency improvements wide-bandgap SiC switches and diodes are offering.