With a combination of low power and high performance, Infineon introduces the new AIROC CYW20829 Bluetooth LE system on chip

Alpitronic has introduced the 50 kW DC electric vehicle charger HYC50. It is a wall-mounted DC charger in this power range featuring two charging ports that allow fast charging of one vehicle at 50 kW or of two vehicles simultaneously at 25 kW each. This is made possible by using EasyPACK CoolSiC TM MOSFET 1B and 2B modules from Infineon Technologies AG in combination with the EiceDRIVER X3.

Following the successful launch of the HYC150 and HYC300 of their hypercharger product line, alpitronic recently introduced the state-of-the-art and industry-leading 50 kW DC electric vehicle charger HYC50.

Infineon expands wireless portfolio to support matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes

Infineon provides secured authentication for Qi 1.3 certified wireless charger in automotive applications

Electronic IDs (eID) can serve to legalise a person's identity in the form of a legal document. In addition to simply identifying the citizen, the functionality of national eIDs can also be expanded to enable people to access government services and benefits online. This eliminates the need to stand in long lines at local government offices, which is a major advantage, especially in times of pandemics.

Five higher technical schools in Carinthia and six in Tyrol received high-precision CO2 sensors from Infineon Technologies Austria AG and MCI in Innsbruck.

Jochen Hanebeck will take over as the new Chief Executive Officer of Infineon Technologies AG on April 1, 2022. Previously Infineon’s Chief Operating Officer, Hanebeck was reappointed for five years.

Personal vehicles, with automated mechanical features rely on a range of comfort motor drive technology, for gliding doors, sliding windows and seat positioning, says Rick Browarski, product marketing manager, Infineon Technologies

Infineon offers a wide selection of automotive-qualified MOSFETs in robust packages for 12V to 48V board net applications. The portfolio of automotive-qualified OptiMOS™ power MOSFETs is offered in diversified packages and range from 30V to 300V with RDS(on) down to 0.55mΩ. The portfolio starts with a small S3O8 and continues to the SSO8 packages in either single, dual, or a half-bridge configuration.

Infineon Technologies AG supports the expansion of the UWB ecosystem, joining the FiFa consortium as a contributing member.  

Infineon Technologies has introduced the SLI37 automotive security controller: an easy to design in and reliable trust anchor to secure safety-critical automotive applications like 5G-ready eUICC (eCall), V2X communication, car access or SOTA updates.  

The EZ-PD BCR (Barrel Connector Replacement) is a highly integrated USB-C controller. Together with the USB-C connector, it replaces barrel connectors, custom connectors or legacy USB connectors in electronic devices.

The fail-operational architectural concept enables SAE Level 3 and 4 Automated Driving Systems (ADS) for highly automated driving. It allows safe and reliable sensor data processing for highway pilot functions, valet parking and autonomous truck driving. It is based on a centralised computer architecture, the design lays the groundwork for the future software-based car. This joint development successfully completes the €50m PRYSTINE res...

Communication interfaces in vehicles is growing – and that entails security challenges for car makers.

In order to meet Europe's ambitious climate targets, greenhouse gas emissions must be drastically reduced by 2030. To achieve this, around 28 million multi-family houses with over 80 million households must be equipped with photovoltaics. Accordingly, Infineon has introduced a solar power sharing technology.

Qualified for automotive applications, Infineon’s EasyPACK 2B EDT2 is a flexible and scalable half-bridge power module.

Flex Power Modules introduces the BMR310, a non-isolated switched capacitor intermediate bus converter which provides high power density for data centres, thus improving board space utilisation and freeing space for other components.

Infineon Technologies has opened a 300mm thin wafer fab in Villach, Austria to make power products.

Infineon Technologies AG launches new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is also tailored for Commercial, construction and agricultural vehicles (CAV) ...