GOEPEL electronic
- Goeschwitzer Str. 58/60
Jena
07745
Germany - +49-3641-68960
- http://www.goepel.com
- +49-3641-6896944
GOEPEL electronic Articles
Test and validation for 6th generation Intel Core processors
The recently launched sixth generation Intel Core processors codenamed Skylake are now also supported with special model libraries for testing and validation. The libraries, called VarioTAP models, allow flexible execution of processor emulation tests using the processor’s native debug interface.
AOI system seems to have it all
GOEPEL electronic introduced its new AOI system - Vario Line – at last week’s productronica. According to the company, it combines the best in fault detection, customer specificity and economic viability with a significant increase in inspection speed while maintaining cost optimization of the overall system.
Model libraries simplfy MCU test process
Specific VarioTAP model libraries for universal processor emulation for the XMC family of Infineon have been announced by Goepel electronics. The processor is reconfigured to provide design-integrated test and programming instruments via the native debug port. A respective VarioTAP model, as part of an extensive IP library, contains all relevant access information for the respective target processor.
Optical inspection solutions on view at productronica
This year’s productronica in Munich will see Goepel electronics demonstrate new and enhanced solutions for Optical Inspection (AOI/AXI/SPI) and electrical test via JTAG/Boundary Scan. Visitors will see the latest technological highlights for PCB quality assurance and learn how effective combination of test technologies allows complete test coverage – resulting in savings of money and time.
System upgrade accelerates 3D inspection of assemblies
The inline AXI system from GOEPEL electronics now offers an even faster high-end 3D inspection of complex assemblies. The “X40 PLUS” upgrade enables an X-ray inspection speed increase of up to 18 percent. Optimising the imaging chain in combination with an improved axle system and faster execution of the test algorithms results in significant savings of cycle time depending on the maximum resolution and the board dimensions.
Embedded system access theme prepared for UK show
A portfolio of technologies for testing, programming, validation, and functional verification at chip, board, and system level, under the umbrella of Embedded System Access (ESA) is being presented by Goepel electronics at the Electronics Design Show in Coventry (October 21-22). Visitors can find out all about the possibilities of JTAG/Boundary Scan.
Boundary scan integrated into ICT platform
The availability of Boundary Scan integration into SPEA’s multi-core ICT (In-Circuit-Test) platform has been announced by Goepel. With the level of integration provided for the SPEA3030 ICT, execution of interactive Boundary Scan tests is now possible on all cores of the ICT (up to four). This results in maximisation of parallelism and productivity.
Software encryption feature protects FPGA IP
Support for the Advanced Encryption Standard (AES) for the 7 Series FPGAs has been announced by Goepel Electronics. The AES feature is designed for better protection against potential attackers and theft of intellectual property from within the FPGA. The Xilinx AES programmer by GOEPEL electronics is integrated into the standard JTAG/Boundary Scan software platform SYSTEM CASCON.
AOI system option allows double-sided THT inspection for PCBs
GOEPEL electronics has expanded the configuration options for the AOI system THT-Line for double-sided inspection of THT assemblies. Besides the accumulating roller conveyor for work piece carriers now also tape transport is available, due to constantly increasing demand frrom users.
Test technology targets IoT devices
JEDOS (JTAG Embedded Diagnostics Operating System) is a new technology for embedded test of complex electronic designs introduced by Goepel Electronics. It has been developed in particular for diagnostic testing of devices for the Internet of Things (IoT). The system architecture offers a complete operating system that uses the natively integrated processor to execute embedded diagnostic functional tests in real time.
Collaboration delivers pull-thru adapter
The PXI 1149/VPC(x) is a pull-thru adapter, developed by a collaboration between Goepel Electronics and the Peak Group. It ensures outstanding signal quality in the interface between Goepel’s PXI/PXIe SCANFLEX Boundary Scan controllers and test fixtures. It completely eliminates the complication of any kind of manual wiring in the configuration of the interface.
Solder inspection system debuts at Nuremberg event
A variety of optical/X-Ray inspection and JTAG/Boundary Scan solutions will be demonstrated by GOEPEL electronics at the SMT/Hybrid/Packaging show in Nuremberg (May 5-7). Visitors will see how electronic manufacturing can be optimised, errors can be minimised and production costs can be decreased through significant innovations expected this year.
I/O module enhances testability of assemblies
GOEPEL electronics has added the SFX-5296LX, a next generation mixed signal I/O module to its JTAG/Boundary Scan hardware platform SCANFLEX. It offers a powerful solution to make even non-scannable partitions testable through boundary scan. This, for example, allows testing of assemblies with just one Boundary Scan IC.
Extreme Testing
How Bit Error Rate Testing IP can help with verifying high-speed interfaces in production. By Hosea Busse, Applications Engineer, GÖPEL electronic.
TAP transceiver boosts production efficiency
GOEPEL electronics has developed a new rack-mountable SCANFLEX TAP transceiver which enables testing and programming of multiple units under test (UUT), using 16 parallel test access ports (TAP). The space- and power-saving SFX-TAP16/G-RM-FXT allows the use in the production line as well as in applications with large distances to the target.
"Deal of the Year" offered on solder paste inspection system
GOEPEL electronics is offering what it describes as “the deal of the year” to mark the anniversary of its high-performance system for three-dimensional solder paste inspection SPI-Line 3D. The system features a 3D camera head allows precise three-dimensional measurement of printed solder paste for the quality assessment of shape, area, volume and planarity.
Software opens up 3D inspection of solder joints
The inspection software PILOT 6 of the AOI systems from GOEPEL electronics enables three-dimensional inspection of solder joints on chip components and IC pins with their extended functionality. The data of the surface topography, generated by the integrated measuring module 3D·EyeZ, can be evaluated in many ways to determine the quality of the solder meniscus.
Software link enhances 3D X-ray inspection system
The high-end 3D X-ray inspection system X-Line 3D from GOEPEL electronics now features a link to the OIC System (Overall Inline Communication) by ASYS Automatisierungssysteme. The OIC system visualises the electronics production line and displays status, product and production process in real time.
VarioTAP model libraries test Bay Trail processors
GOEPEL electronics has developed specific model libraries for testing and programming of Intel Bay Trail processors, which are part of the Intel Atom family. The libraries called VarioTAP models allow flexible execution of processor emulation tests using the native debug port. Users are now able to use the processor as an instrument for hardware design validation of prototypes as well as programming of Flash devices.
PCB size no problem for automated inspection system
GOEPEL electronics is offering a variant of the inline AOI system AdvancedLine for the inspection of overlength PCBs. The longboard AOI system enables testing of assembled and soldered PCBs with a length of up 1,600mm. An adjustment for even longer PCBs is also possible due to the flexibility of the overall design.