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GOEPEL electronic

GOEPEL electronic Articles

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Test & Measurement
29th July 2019
3D inspections now cover solder paste

The 3D AOI systems Basic Line · 3D and Vario Line · 3D from GÖPEL electronic can now also perform a complete solder paste inspection as well as placement control before the soldering process. In addition to the 3D/2D inspection tasks, the systems become even more flexible.

Analysis
9th July 2019
Daglish joins Goepel in sales engineer role

Cambridge-based GOEPEL electronics has strengthened its sales and service presence in the UK and Ireland by adding a Technical Sales Engineer. Mark Daglish is now responsible for the company’s product ranges of Embedded JTAG Solutions equipment as well as Inspection Solutions (Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI) and Solder Paste Inspection (SPI) systems).

Test & Measurement
26th June 2019
ADAS SoC becomes test and programming instrument

The VarioTAP technology for universal processor emulation to the R-Car V3M SoCs (System-on-Chip) from Renesas has been extended by GÖPEL electronic. This transforms the processor into a design-integrated test and programming instrument via the control of the debug port.

Test & Measurement
15th May 2019
Detector option enhances assemblies inspection kit

The inline X-ray system X Line · 3D Series 400 from Goepel has a new detector option for high-resolution 3D X-ray inspection of electronic assemblies. The MultiAngle Detector 3 combines the high image quality of the StingRay Detector introduced last year with the rapid inspection speed of a scanning image.

Communications
30th October 2018
Media converter targets automotive Ethernet

Automotive Ethernet is a standardised interface in the automotive industry and an important component of future vehicle architectures. GOEPEL electronic has now developed the second generation of the EasyCON media converter. It physically converts a standard Ethernet layer to Automotive Ethernet 1000/100 Base-T1.

Events News
15th October 2018
Test systems cover development and production

Test and inspection solutions for electronics development and production will be showcased by Goepel at electronica 2018 in Munich (November 13-16). Centre stage is ChipVORX-SI, a future-oriented platform using powerful FPGA-IP for test & in-system programming.

Test & Measurement
9th September 2018
Test solutions extended to support Intel Arria 10 SoC

The embedded board test technologies ChipVORX and VarioTAP from GOEPEL electronic now support the Intel Arria 10 SoC (System-on-Chip). The new IP models simplify testing and programming of the devices.

Analysis
13th August 2018
Daughter succeeds father at GOEPEL electronic

There will be a changing of the guard at GOEPEL lectronic on August 15, when Alice Göpel will take over the Managing Director position of GOEPEL electronic. She replaces her father Holger Göpel, who has been managing the company since 1991. He is retiring but will still be available to the company as a consultant.

Test & Measurement
16th July 2018
WLAN connection enhances boundary scan controller

The JTAG/Boundary Scan controller SCANFLEX II Cube from Goepel electronic now has an optional Wireless LAN interface. Previously, the controller had USB 3.0 or LAN interfaces as standard. With the new option, another control interface is now available. SCANFLEX II Cube is a modular JTAG/Boundary Scan controller.

Test & Measurement
1st June 2018
Module measures and tests analogue voltages on 128 channels.

The SFX/VPC-AMC128 (Analog Measurement Card) is a new test extension module. It can be used to measure and test analogue voltages on 128 channels. The module can be easily integrated into the in-line test system RAPIDO from GOEPEL electronic, as well as into customer-specific test systems.

Test & Measurement
4th May 2018
Multibus communication controllers aid ECU development

A new generation of multibus communication controllers under the name “Series 62” has been announced by Goepel electronic. The architecture offers users up to 18 independent bus interfaces for CAN, CAN-FD, FlexRay, Automotive Ethernet and LIN. This results in numerous configurations and thus application options for optimum adaptation to the UUT (unit under test) or the test task.

Component Management
11th April 2018
Software option protects FPGA designs

A Security Key Programming software option that allows programming of a 256-bit AES key for Altera Cyclone V FPGAs has been released by Goepel electronic. It activates the design security in the FPGA, thus bitstreams can no longer be analysed. This protects the FPGA design against re-engineering, cloning and copying.

Communications
13th February 2018
Stress module designed for automotive Ethernet applications

  With basicCON 4045, GOEPEL electronic has presented a stress module specifically for automotive Ethernet applications (BroadR-Reach). The simulation of physical faults manipulates the ECU communications, allowing conclusions to be drawn about the stability and robustness of Ethernet vehicle applications.

Test & Measurement
9th January 2018
Boundary scan test extended to PSoC 4 controllers

The VarioTAP model range has been extended by Goepel to include Cypress PSoC 4 controllers. The VarioTAP model libraries allow a complete fusion of Boundary Scan test and JTAG emulation. The processor is controlled via the native debug port, allowing users to perform hardware design validation and prototype testing without firmware.

Test & Measurement
6th November 2017
productronica 2017: Detector aids X-ray inspection

StingRay Detector is the name of the new image acquisition concept for fully automatic X-ray inspection of single-sided and double-sided PCBs from Goepel electronic. It enables selective 2D, 2.5D and 3D X-ray inspection with high image quality at highest speed. The StingRay Detector is another option for the inline AXI systems of the X Line · 3D family. It will be on show at productronica in Munich (November 14-17).

Events News
13th October 2017
productronica 2017: X-ray detector to feature

At productronica in Munich (November 14-17), GOEPEL electronic will present fully automated inspection solutions, offering high fault detection, flexibility and cost reductions through time savings. Being highlighted is the new StingRay X-ray detector, an additional option for the system family X Line · 3D.

Test & Measurement
6th October 2017
Interface card supports JTAG/Boundary Scan protocols

With the TIC022-MUX/SR, GOEPEL electronic is presenting an external TAP interface card (TIC) for operation with the Embedded JTAG Solutions platform SCANFLEX. The module serves as the interface for performing various test and programming procedures and can also be integrated into other test systems, such as In-Circuit testers and flying probers.

Test & Measurement
18th September 2017
Communication controller is compatible with Linux

The Series 61 communication controller portfolio for CAN/CAN-FD, FlexRay, K-Line and LIN has been extended to be compatible with Linux by GOEPEL electronic. The interface has been ported; function names and parameters remain unchanged, so users can easily develop platform-independent software. The G-API (GOEPEL electronic Application Programming Interface) previously only supported Windows-based systems.

Test & Measurement
14th August 2017
X-ray inspection systems fit the bill for automotive supplier

The Italian automotive supplier Magneti Marelli has chosen two X-ray inspection systems from GOEPEL electronic for its quality assurance of electronic assemblies. At production sites in France and Slovakia, the X Line · 3D systems are used to inspect high-complexity PCBs. Electronic assemblies for automobiles are subject to particularly high quality requirements by the manufacturers.

Test & Measurement
26th July 2017
Software enables time-efficient testing of USB controllers

A special software option for the use of the VarioTAP emulation technology on Cypress USB 3.0 controllers has been developed by Goepel electronic. The EZ-USB FX3 can now be tested and programmed much more efficiently due to special model libraries. Users also benefit from cost savings for additional test and programming equipment.

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