DELO has further developed its liquid materials, creating new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions.

Having further developed its liquid materials, DELO has created new possibilities for liquid additive manufacturing. The high-performance materials providing different functionalities, such as transparency or flexibility can be combined in one printing process, adhere reliably, and have isotropic strength in all printing directions. They are particularly well suited for automotive and microelectronic applications.

DELO has developed a particularly space-saving UV lamp for adhesive curing. The powerful DELOLUX 503 is designed for industrial applications requiring small surfaces to be bonded within seconds in serial production lines, for example for bonding cameras used in autonomous cars.

DELO has introduced a new, silicone-free liquid sealant for the automotive, electronics, and white goods industries. Curing by light, DELO PHOTOBOND SL4165 protects from dust, air, and water. The flow-resistant, highly viscous liquid sealant can be applied in the desired height and any geometric shape. 

Microdispensing in the electronics industry can help to increase the service life of individual components. Glob Top Potting, for example, protects sensitive components, usually semiconductor chips, from mechanical stresses such as vibrations or temperature fluctuations. It also protects them from external environmental influences such as moisture or corrosion. A viscous resin matrix is applied, mostly an epoxy resin adhesive.

A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.

A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.

Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, is a sponsor of Wisconsin Racing at the University of Wisconsin. DELO has supplied Wisconsin Racing’s Formula Electric team with DELO MONOPOX HT2860 to bond together the magnet segments in the car’s electric motor. The adhesive is also used for final rotor assembly.

Manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, DELO, has developed an encapsulant with very high resistance to media and temperature. DELO MONOPOX GE6515 offers an optimised curing time, speeding up production processes. 

Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behaviour, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and DELO Industrial Adhesives, covering more than 6 million dispensing cycles.

A new webinar program has been published by DELO. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility. Adhesive bonding is considered the joining technology of the 21st century and allows for light-weight construction, miniaturisation, and multi-material design.

DELO has developed a structural adhesive that offers increased stability at high temperatures. DELO MONOPOX HT2860 achieves up to three times the strength at a temperature of 150°C compared to previous product generations.

DELO has developed two new activators accelerating the adhesion build-up of metal adhesives such as DELO-ML. They allow speeding up production even without containing solvents, which simplifies work safety measures. Activators reduce the curing time of metal adhesives, which achieve their strength under exclusion of oxygen. However, in contrast to metal adhesives or other reaction adhesives, most activators contain solvents.

DELO Industrial Adhesives has developed a light-curing acrylate with excellent peel resistance for seal-bonding. DELO PHOTOBOND GB4033 has features that make it suitable for universal use, for example, in electronic applications. Designed for service temperatures ranging from -40 to +120°C, it is particularly suited for material joints that require adhesives not only to be strong but also flexible and tight. 

DELO has introduced an adhesive for optoelectronic applications. Called DUALBOND OB786, it is particularly suited for fixing components within seconds while ensuring precision and high strength. After an irradiation time of less than one second, the build-up of adhesion is already significant; after five seconds, the compression shear strength on glass even reaches 18 MPa

DELO Industrial Adhesives introduces a new generation of the DELOLUX 20 and DELOLUX 202 LED area lamps with higher intensities. Both lamps can be operated and controlled via the touch screen of the newly developed DELOLUX pilot. The LED curing lamps ensure utmost reliability in adhesive curing. Their slim design makes it possible to combine any number of lamp modules of the same type, allowing homogeneous curing of large bonding areas.

Full curing of adhesives requires either patience or suitable tools to accelerate this process. Conventional 2C adhesives take between 24 hours and up to seven days to reach their final strength. In a manufacturing process, however, the curing time of adhesives needs to be adjusted to the cycle times in series production, which implies fast and highly reliable curing. 

DELO has introduced an electronic adhesive featuring very thin and high walls at the same time. DELOMONOPOX GE7985 has been developed for automotive and industrial applications requiring high reliability in combination with miniaturized designs.

A two-component adhesive for aircraft interiors has been developed by DELO Industrial Adhesives. DELO-DUOPOX AB8390 is particularly suited for bonding of light-weight sandwich panels. Before adhesives can be used in aircraft interiors, they are subjected to various tests to prove their suitability. 

DELO is now offering DELO-DUOPOX SJ8665, a two-component adhesive that is said to provide flexibility and reliability in the production of electric motors. This impact-resistant epoxy resin can be used in a medium temperature range, making it ideal for bonding surface magnets that are subject to sudden loads and fixing stator laminations to housings.