congatec – a vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. 

congatec has opened a digital trade show booth as a permanent exhibition on their website, providing additional learning opportunities for potential customers who are unable to attend trade fairs and exhibitions due to the pandemic, 

congatec has announced its strategic partnership with SYSGO to create Computer-on-Modules meet functional safety and security

Congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

congatec has introduced new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40 to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

congatec has extended its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilisation of the new processor integrated NXP Neural Processing Unit (NPU).

congatec has announced the foundation of congatec Korea to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.

The congatec CMEF showcase put the spotlight on the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theaters as well as mobile emergency and intensive care equipment.

congatec has presented a low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

congatec has introduced a brand new COM-HPC starter set. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (code name Tiger Lake).

congatec has introduced the conga-TCV2, a COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen Embedded V1000, the module has good performance per watt, and finds its sweetest spot in 15W TDP designs.

congatec has presented its new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL.

congatec has presented a new COM-HPC starter set at embedded world 2021 DIGITAL. Optimised for modular system designs utilising the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel Core processor technology (cod...

congatec has focused on customers’ ruggedisation challenges for virtual embedded world 2021, and will be presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. 

Tasks at the embedded edge are getting more and more complex. Supporting up to eight cores and 16 threads, the recently launched AMD Ryzen Embedded V2000 processors are hoping to pave the way for x86-based embedded designs with high compute density and performance per watt.

congatec has introduced the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilisation of congatec’s COM-HPC modules based on the latest 11th Gen Intel Core processors (code name Tiger Lake).

congatec has broadened the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the COM Express Compact footprint.

congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the TSN Ethernet standard based on latest Intel IP technology.

congatec has introduced six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to withstand extreme temperatures from -40 to +85°C, the new COM-HPC and COM Express Type 6 Computer-on-Modules provide all features and services required for reliable operation in the most challenging environments.

congatec has announced that it is expanding its embedded and edge computing solution platform offering to include the new market of rugged fog computer technologies. Used in various industrial as well as critical network applications, rugged fog computers reside in the network computing and communication pyramid above the edge device layer.