congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS.

AMI and congatec announce the celebration of their 20-year business partnership. Since 2005, AMI and congatec have worked closely together to deliver innovative embedded computing solutions to customers worldwide. This long-standing collaboration has driven both companies to develop advanced technologies and provide exceptional support to their shared customer base – even for the most sophisticated technical challenges for embedded systems...

congatec premiered its heat pipe cooling solution for extreme environmental conditions at embedded world 2025. The cooling solution uses acetone as a working fluid in the heat pipes instead of water. This prevents the thermal transfer medium from freezing at extreme sub-zero temperatures and prevents damage to the cooling solution, the module, and the entire system design. It is also insensitive to mechanical stresses such as shock and vibration....

congatec's Computer-on-Module conga-TC750 has been shortlisted for the Electronics Excellence Awards under the Electromechnical Product category.

congatec, a provider of embedded and Edge Computing technology, is updating its conga-SA8 SMARC modules: the low-power Computer-on-Modules (COMs) are now available with the latest Intel Core 3 processor generation.

congatec has expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COMs) with the conga-HPC/cBLS, which has been developed for power-hungry Edge and infrastructure applications.

congatec has announced a partnership with Canonical, the publisher of Ubuntu, enabling congatec to offer the best out-of-the-box experience by bulding aReady.COMs wityh Ubuntu Pro.

At embedded world North America, congatec unveiled its latest hardware and software offerings designed to streamline product development and improve time-to-market for its customers.

For the first time, Intel Core i processors with up to eight E-cores are now available on SMARC Computer-on-Modules. This allows even the smallest fanless low-power systems for extended temperature ranges to benefit from extremely powerful AI inference logic and enhanced virtualisation options, improving cyber security among other advantages.

Congatec will highlight its Computer-on-Modules portfolio, featuring aReady.COM configurations, at embedded world NA (booth 2223).

Congatec, a provider of embedded and Edge computing technology, introduces new COM Express Compact Computer-on-Modules with AMD Ryzen Embedded 8000 Series processors.

congatec, a provider of embedded and Edge computing technology, presents new high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors.

congatec and Thomas-Krenn.AG, two powerhouses for embedded and edge systems and servers, have joined forces in a new collaboration.

congatec has presented the first board-level product in its line with its recently introduced aReady. strategy.

congatec – a provider of embedded and Edge computing technology – presents new rugged SMARC modules based on the Intel Atom x7000RE processor series (codenamed Amston Lake) and the Intel Core i3 processor.

congatec, a provider of embedded and Edge computing technology, welcomes the publication of COM-HPC Carrier Design Guide Rev. 2.2, which provides developers with performance specifications and a source of inspiration for the layout of modular designs on the basis of the small 95 x 70mm COM-HPC Mini specification.

Congatec, a provider of embedded and Edge computing technologies, has expanded its ecosystem for modular edge servers.

congatec has unveiled its latest innovation: the aReady.COM product family. This marks the inaugural phase of the aReady. strategy, designed to streamline the implementation of embedded and Edge computing technology.

Bosch Rexroth has opened up the Linux-based ctrlX OS operating system for embedded computer applications from congatec.

Congatec is set to unveil a series of new IIoT Computer-on-Modules at embedded world (Hall 3, Booth 241).