congatec welcomes PICMG's ratification of the COM-HPC 1.2 specification, which introduces the COM-HPC Mini form factor. This new specification provides high-performance capabilities in a small form factor, measuring only 95 mm x 70 mm. Even devices with limited space can now benefit from the superior bandwidth and interface offerings of COM-HPC, including PCIe Gen 5 and Thunderbolt.

Congatec, a vendor of embedded and edge computing technology, has announced the launch of its latest SMARC module 2.1 Computer-on-Modules based on Texas Instruments Jacinto 7 TDA4x or DRA8x processors.

Congatec, a vendor of embedded and edge computing technology, is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.

The two German embedded and edge computing heavyweights, congatec and Kontron, have concluded a cooperation agreement to standardise the design schematics of COM-HPC evaluation carrier boards from both companies, and to publish most of these schematics in public design guides.

congatec announced the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC.

congatec will be presenting its comprehensive COM-HPC ecosystem at embedded world 2023 (hall 3/booth 241). The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that is hardly larger than a credit card.

Congatec announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address applicati...

congatec, a specialist vendor of embedded and edge computing technology, announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly.

congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95 x 60mm) Computer-on-Module specification COM-HPC Mini. The COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023.

congatec, a vendor of embedded and edge computing technology, welcomed the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake).

congatec, a vendor of embedded and edge computing technology, has introduced its new ecosystem for TSN aimed at networked factories and critical infrastructures.

congatec has introduced its first modular Micro-ATX compliant carrier board with COM-HPC interface.

Intel Labs China has chosen congatec COM Express modules for easy and efficient design-in and flexible processor scalability in its Heterogeneous Extensible Robot Open (HERO) platform.

congatec, a leading vendor of embedded and edge computing technology, has introduced seven less power-hungry variants of the 12th Generation Intel Core IOTG (Intel's Internet of Things Group) mobile processors (formerly codenamed Alder Lake) on seven new COM-HPC and COM Express computer-on-modules.

congatec announced massive investments in functional safety (FuSa) at embedded world 2022 in Nuremberg.

At embedded world 2022 in Nuremberg congatec and System Industrie Electronics (SIE) launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector.

congatec announces that its SMARC Computer-on-Modules based on NXP i.MX8 M Plus processor technology have achieved SystemReady IR certification within the Arm driven Cassini project.

congatec, a vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

congatec, a vendor of embedded and edge computing technology, celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.

Congatec a vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.