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Cadence Design Systems

  • Bagshot Road Bracknell Berkshire
    RG12 OPH
    United Kingdom
  • +44.1344.360333
  • http://www.cadence.com
  • + 44.1344.869647

Cadence Design Systems Articles

Displaying 381 - 400 of 552
Design
6th March 2014
Environment speeds PCB timing closure by up to 67%

Speeding timing closure by up to 67%, Cadence Design Systems has announced that the Allegro TimingVision environment is now available within Cadence Allegro PCB Designer. This environment makes it possible for PCB designers to save significant time in ensuring that signals in an interface meet timing requirements.

Analysis
19th February 2014
Forte Design Systems aquired by Cadence

Cadence have announced that they have completed the acquisition of Forte Design Systems, a provider of SystemC-based HLS and arithmetic IP.

Design
14th February 2014
The industry’s first Android technology for a licensed DSP

Taking full advantage of enhancements in the recent Android 4.4 (KitKat) release to prolong battery life in smartphones and mobile devices, Cadence Design Systems announces Tensilica HiFi Audio Tunneling for Android. The company have claimed that this is the industry’s first Android-compatible technology for a licensed digital signal processor (DSP).

Events News
13th February 2014
Cadence demo ADAS at embedded world 2014

At this year’s embedded world Exhibition & Conference, February 26-28, 2014, in Nuremberg, Germany, Cadence Design Systems will present Advanced Driver-Assistance Systems (ADAS) including augmented reality, a car simulator with attention assistance, a car simulator with adaptive cruise control, traffic sign recognition and automotive Ethernet.

Analysis
6th February 2014
Cadence to aquire Forte Design Systems

Cadence have entered into an agreement to aquire Forte Design Systems. Terms of the transaction were not disclosed, with the acquisition expected to close within 30 days. The transaction is expected to be slightly accretive to Cadence’s 2014 results of operations and accretive in 2015 and beyond.

Design
29th January 2014
DDR4 PHY IP for 28nm achieves 2667Mbps performance

Claiming to have achieved the highest known performance in the industry, Cadence have announced that their DDR4 PHY IP for 28nm delivered 2667Mbps performance. The DDR4 PHY IP is a silicon-proven, robust and low-risk DDR PHY that has been verified with the Cadence DDR4 controller IP.

Design
14th January 2014
HEVC IP design time reduced by 70% with C-to-Silicon Compiler

Renesas have announced that, through using Cadence C-to-Silicon Compiler, that they have been able to shorten HEVC IP design and verification time by 70%. This enabled the company to quickly offer their customers IP supporting this next-generation video codec.

Design
7th January 2014
Cadence licenses MPEG AAC codecs from Fraunhofer IIS

Licensing the full suite of MPEG AAC codecs from Fraunhofer IIS for use with the Tensilica HiFi DSP, Cadence Design Systems plans to use the products to enhance the library of over 100 audio/voice software packages optimised for the HiFi DSP family. New standards include the AAC-ELD communication codec, which enables telephone conversations with the highest possible audio quality, and xHE-AAC, which is the latest upgrade to the MPEG AAC family of...

Design
25th November 2013
RTL Complier expands physically aware RTL synthesis capabilities

The new Encounter RTL Compiler version 13.1 from Cadence now includes a new suite of physically aware RTL synthesis capabilities. This new suite of physically aware RTL synthesis capabilities enables 15 percent improvement in power, performance and area on today’s most complex advanced node chip designs that face timing or congestion challenges. The new capabilities enable engineers to use physical aware techniques at the earliest phases o...

Power
13th November 2013
Achieve up to 10 times faster power signoff

Cadence Design Systems has announced a new power signoff solution which delivers record performance and capacity power analysis. Meeting the needs of next-generation chip design, Voltus IC Power Integrity Solution is integrated with Cadence IC, package, PCB and system tools. This integration allows designers to better manage power issues throughout the product development cycle and achieve up to 10 times faster power signoff.

Design
31st October 2013
Interconnect Workbench analyses and verifies ARM-based SoCs

Cadence Design Systems introduce the new Cadence Interconnect Workbench, a software solution providing cycle-accurate performance analysis of interconnects throughout the system-on-chip design process. Quickly identifying design issues under critical traffic condition, Interconnect Workbench enables users to improve device performance and reduce time to market. Working with Cadence Interconnect Validator, Interconnect Workbench offers a complete ...

Design
18th October 2013
Cadence Introduces 10X Faster Spectre XPS FastSPICE Simulator

At CDNLive India 2013, Cadence Design Systems, Inc today introduced Spectre XPS (eXtensive Partitioning Simulator), a high-performance FastSPICE simulator that enables faster and more comprehensive simulation for large, complex chip designs. The new simulator delivers ground-breaking partitioning technology that brings up to 10X faster throughput compared to competitive offerings, shortening simulation from weeks to days.  Spectre XPS unique...

Communications
18th October 2013
First IP core solution to offer DTS neural surround unveiled

Cadence Design Systems is the first IP core supplier to offer DTS Neural Surround Support. DTS Neural Surround, combined with the Cadence Tensilica HiFi Audio/Voice DSPs, brings a home theater-like experience to automobiles and A/V receivers. This significantly enhances the sound quality of upmixing from compressed media file types such as MP3.

Analysis
4th October 2013
Cadence Receives Three TSMC Partner of the Year Awards for Design IP, 16nm FinFET and 3D-IC Solutions

Cadence Design Systems, Inc today received three TSMC Partner of the Year Awards during TSMC’s Open Innovation Platform forum – accepting the most awards from the event. Cadence was presented awards for three different categories including awards for analog/mixed signal IP, 16nm FinFET design infrastructure, and 3D-IC design solutions.  The awards underscore the deep collaboration between the two companies in bringing the highest...

Design
17th September 2013
Cadence Secure Digital 4.0 Host Controller IP Core

Cadence Design Systems has introduced its Secure Digital 4.0 Host Controller Intellectual Property core, which allows designers to achieve the maximum memory card access performance of up to 312MB/s. This is 3 times the performance of the previous specification. The Cadence SD 4.0 Host Controller IP core is compliant with SD Specification Version 4.0 by the SD Association and is the fastest IP solution on the market.

Design
12th September 2013
Cadence Launches Palladium XP II Verification Platform and Enhanced System Development Suite

In a move to further reduce time to market for both semiconductor and system manufacturers, Cadence Design Systems Inc today introduced the Palladium XP II Verification Computing Platform as part of an enhanced System Development Suite, significantly speeding up hardware and software verification. The Palladium XP II platform builds on the award-winning Palladium XP emulation technology by boosting verification performance by up to 50% and extend...

Design
12th September 2013
Cadence speeds hardware and software verification

In an move to further reduce time to market for both semiconductor and system manufacturers, Cadence Design Systems has today introduced the Palladium XP II Verification Computing Platform as part of an enhanced System Development Suite, significantly speeding up hardware and software verification. The Palladium XP II platform builds on the award-winning Palladium XP emulation technology by boosting verification performance by up to 50% and exten...

Analysis
25th July 2013
Cadence reveal second quarter 2013 financial results

Cadence Design Systems reveal their second quarter of fiscal year 2013 results. Cadence reported second quarter 2013 revenue of $362 million, compared to revenue of $326 million reported for the same period in 2012. On a GAAP basis, Cadence recognized net income of $9 million, or $0.03 per share on a diluted basis, in the second quarter of 2013, compared to net income of $36 million, or $0.13 per share on a diluted basis, in the same period in 20...

Design
19th July 2013
Cadence Physical and Electrical DMF Signoff adopted by UMC

Cadence Design Systems reveal that after extensive benchmark testing, semiconductor foundry United Microelectronics Corporation has adopted the Cadence “in-design” and signoff design-for-manufacturing flows to perform physical signoff and electrical variability optimization for 28nm designs. The flows address both random and systematic yield issues, providing customers with another proven foundry flow for 28nm designs.

Design
19th July 2013
Hitachi utilize the Cadence Rapid Prototyping Platform

Cadence Design Systems reveal that Hitachi decreased development time and accelerated time to market for new IT products by utilizing the Cadence Rapid Prototyping Platform. Hitachi collaborated with Cadence as a strategic partner on an integrated verification and early software development environment to enhance quality and shorten turnaround time for Hitachi’s new IT products. Hitachi successfully implemented a system-level co-verification en...

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