Indium hosts webinar on lead-free solder paste for automotive applications

The webinar, part of Indium Corporation’s free InSIDER Series, will be hosted on LinkedIn Live on 17^th April 2024 at 11am EST.

“Among other features such as versatile compatibility with SAC305 reflow profiles, Durafuse HR shows dramatically improved voiding performance along with high thermal fatigue resistance compared to SAC305 and other high-reliability solder pastes,” said Dr. Geng. “I believe that this technology has the ability to revolutionise automotive soldering processes, and I look forward to sharing this exciting data with my industry colleagues.”

As Senior Research Metallurgist, Dr. Geng leads research projects and works innovatively to deliver timely solutions for both customers and the market. He designs implementation and adjustments of experiments, analyses the root cause of product failures to create solutions, and trains and leads research associates in laboratory projects.

Since joining Indium Corporation in 2016, he has excelled in technology development, as demonstrated by his recent success with Indalloy292 and Durafuse HR. Dr. Geng holds a doctorate in metallurgy, a master’s degree in materials science, and a bachelor’s degree in materials science and engineering.

The webinar will also be made available for on-demand viewing afterward at the indium website.