Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, 6-8th May, in Nuremberg, Germany.

Indium recently earned two CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for its high-reliability alloy used for solder paste, Durafuse HR, and its high-reliability, halide and halogen-free flux-cored wire, CW-807RS.

Indium Corporation will present its range of thermal interface materials (TIMs) designed for AI applications at Productronica China, taking place from 26th-28th March in Shanghai.

Indium is due to introduce its newest Heat-Spring pattern HSx, designed for large area dies with warpage patterns and pressure limitations. HSx will be introduced at TestConX 2025, running from 3-5 March in Arizona, US.

Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.

Indium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, 28–30 January 2025, in San Francisco, California. SPIE West is one of the world’s premier events for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.

Indium Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on 22–24 January 2025, in Tokyo, Japan.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place 22–24 January 2025, in Tokyo, Japan.

Indium will feature its high-reliability AuLTRA MediPro gold solder solutions at MD&M West, running 4-6 February in Anaheim, California.

Indium Corporation has announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.

Indium Corporation is proud to announce its recent achievement of the Excellence in Electronics Assembly Materials Award from Electronics Era, as part of the EE Excellence and Achievers Awards 2024.

 Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia. 

Indium Corporation has earned a Mexico Technology Award for its high-reliability mixed-alloy for solder paste, Durafuse HR.

Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on 12th September 2024 in Delhi, India.

Indium Corporation Junior Application Engineer, Siegfried Lorenz, will present as part of Delsys Tech Day on September 11, in Lucerne, Switzerland.

Indium Corporation will feature its innovative Durafuse solder technology at productronica India, September 11-13, in Delhi, India.

Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on 5th September 2024 in Taipei, Taiwan.

As a innovator in materials for cutting-edge technologies, Indium Corporation is set to highlight its advanced heterogeneous integration and assembly (HIA) products, along with thermal interface materials (TIMs) driving AI progress, at SEMICON Taiwan from September 4-6 in Taipei.

Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms.

Indium Corporation has introduced a new jetting solder paste to join its PicoShot series of products.